Rapid solidification mechanism of highly undercooled ternary Cu40Sn45Sb15 alloy

Zhai, Wei; Wang, B. J.; Lu, Xiaowang; Wei, B.

doi:10.1007/s00339-015-9430-7

Cited by 7 publications

(4 citation statements)

References 24 publications

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“…Clevenger et al 35 reported the onset of Cu 3 Sn formation from the reaction between Cu 6 Sn 5 and Cu. The Cu 3 Sn phase can be formed by conventional casting 36,37 , directional solidification 8,23,26 and rapid solidification methods [38][39][40] . Due to the solidification temperature differences, initially the Cu-rich Cu 3 Sn and Cu 6 Sn 5 IMC phases solidified, followed by Sn-rich and Bi-rich phases at a lower temperature.…”

Section: Determination Of the Chemical Components Of The Phasesmentioning

confidence: 99%

Microstructural evolution and mechanical properties of Sn-Bi-Cu ternary eutectic alloy produced by directional solidification

2018

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Sn-36Bi-22Cu (wt.%) ternary eutectic alloy was prepared using vacuum melting furnace and casting furnace. The samples were directionally solidified upwards solidification rate varying from 8.3 to 166 µm/s and at a constant temperature gradient (4.2 K/mm) in a Bridgman-type directional solidification furnace. The composition analysis of the phases and the intermetallics (Cu 3 Sn and Cu 6 Sn 5 ) were determined from EDX and XRD analysis respectively. The variation of the lamellar spacing (Bi-rich phase) and the Cu 3 Sn phase spacing with the solidification rate were investigated. The dependence of microhardness, ultimate compressive strength and compressive yield strength on solidification rate were determined. The spacing and microhardness were measured from both longitudinal and transverse sections of the samples. The dependence of microhardness on the lamellar spacing and the Cu 3 Sn phase spacing were also determined. The relationships between phase spacings, solidification rate and mechanical properties were determined from linear regression analysis.

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Section: Determination Of the Chemical Components Of The Phasesmentioning

confidence: 99%

Microstructural evolution and mechanical properties of Sn-Bi-Cu ternary eutectic alloy produced by directional solidification

2018

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“…The Cu−Sn alloys has good anti-fretting characteristics and corrosion resistance for practical use. Although of the good characteristics of Cu-Sn alloys; works focused on the importance of process variables of solidification on the microsegregation and resulting microstructure still is scarce in the literature [15][16][17][18] . The influence of cooling rate on the intermetallic phase (Cu 6 Sn 5 ) formation in the Cu-Sn alloys, distribution and microstructure were studied by Mardare and Hassel 15 .…”

Section: Introductionmentioning

confidence: 99%

“…One can see that particle size increased as the cooling rate decreased and for samples cooled under low solidification growth a needle structure perpendicular to the solidification front is found. The rapid solidification of ternary alloy (Cu-Sn-Sb) was realized by Zhai et al 16 . The constitution of ternary alloy in these rapid solidification experiments proposed by Zhai et al 16 , deviates from the equilibrium phases.…”

Section: Introductionmentioning

confidence: 99%

“…The rapid solidification of ternary alloy (Cu-Sn-Sb) was realized by Zhai et al 16 . The constitution of ternary alloy in these rapid solidification experiments proposed by Zhai et al 16 , deviates from the equilibrium phases. The solidification microstructure is characterized by lamellar structure, based on inner strips of primary phase ε(Cu 3 Sn), the intermediate layer of η(Cu 6 Sn 5 ), and the outer layer β(SnSb).…”

Section: Introductionmentioning

confidence: 99%

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