Rate dependent constitutive relations based on Anand model for 92.5Pb5Sn2.5Ag solder

Wilde, Jürgen; Becker, Karl‐Friedrich; Thoben, M.; Blum, W.; Jupitz, T.; Wang, Guozhong; Cheng, Zhi‐Lin

doi:10.1109/6040.861554

Cited by 105 publications

(38 citation statements)

References 21 publications

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“…A FOR-TRAN subroutine, calculating the stress increment and material Jacobian matrix, knowing the strain field, was written. Simulations and verifications with various solders revealed that there are good agreements between the user subroutine and bibliography results presented in [16,17]. Table 4 lists hereafter the two solders constitutive laws parameters.…”

Section: Solders Jointsmentioning

confidence: 99%

Reliability of the connections used in IGBT modules, in aeronautical environment

Zéanh

Dalverny

Karama

et al. 2008

Int. J. Simul. Multidisci. Des. Optim.

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-In this paper, two IGBT modules assembling technologies with double side cooling capabilities and high level of integration were proposed for aeronautic applications after a state of the art and failures analysis. These technologies are compared using design of experiment based on non-linear finite element analysis with various materials, with respect to their potential failures under thermal and power loading profiles. The configurations optimizing the lifetime and reliability level were pointed out by loading profile and failure mode. Recommendations were then done in order to choose the optimal configuration of assembly for each application. Finally, these design rules were followed by the study of parts dimensions effects on the design outputs in order to help dimensioning the IGBT modules.

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Section: Solders Jointsmentioning

confidence: 99%

Reliability of the connections used in IGBT modules, in aeronautical environment

Zéanh

Dalverny

Karama

et al. 2008

Int. J. Simul. Multidisci. Des. Optim.

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“…Lots of scholars implemented the Anand model to simulate the stress-strain relationship of a variety of solders successfully. [4][5][6][7][8][9][10][11][12][13] However, Chen et al 3 found that the Anand model cannot accurately predict the response of material which has the specification of strong strain-hardening effect at low temperature. Thus, they proposed a modified Anand model by correlating h 0 with temperature and strain rate…”

Section: Models Without the Definition Of Yield Surfacementioning

confidence: 99%

A critical review of constitutive models for solders in electronic packaging

Chen

Zhao

2017

Advances in Mechanical Engineering

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Owing to their superior electrical, thermal, and mechanical properties, solder joints are the most widely used interconnection materials in electronic product packaging. Because the failure of the whole electronic packaging is often induced by the failure of solders, modeling and simulation of solder joint performance are quite important in ensuring the quality and reliability of electronic products. In fact, the accuracy of reliability design of electronic packaging is dependent on accelerated reliability tests, material constitutive models, finite element modeling, and fatigue-life prediction models. Here, the material constitutive model plays the most important role in the development of electronic reliability design because the stress, strain, and strain energy density adopted in finite element modeling and fatigue-life prediction are all computed and derived from the constitutive model. In this work, the constitutive models developed for simulating the complex stress and strain response of solders are critically reviewed. To make the description concise and comprehensive, the constitutive models were categorized into two types: the constitutive models with and without the definition of yield surface. The prediction capabilities, application scope, merits and shortcomings, and objective suggestions for the further development of constitutive models for solders in electronic packaging are proposed.

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“…Within the framework of this model, there appears a scalar-valued function for the equivalent plastic strain rate and an evolution equation for the internal variable. Based on the compression test data, the material parameters of indium bump in Anand's model were determined to simulate the steady-state viscoplastic behavior and stress/strain responses [9,10]. The model accommodates the strain rate dependence on the stress using the following expression…”

Section: Model Creation and Parameters Selectionmentioning

confidence: 99%

Analysis of Structural Stress in 8􀀁8 InSb Array Detector

Meng¹,

Wei²,

Lv³

et al. 2011

TOEEJ

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Based on viscoplastic Anand's model, structural stress of 8 8 InSb array detector dependent on indium bump sizes is systemically researched by finite element method. For the detector with underfill, simulation results show that as the diameters of indium bump decrease from 36μm to 20μm in step of 2μm, the maximum stress existing in InSb chip first reduces sharply, then increases flatly, and reaches minimum with indium bump diameter 32μm. When the height of indium bump increases from 9μm to 21μm in step of 6μm, the maximal stress in InSb chip first reduces sharply from 800MPa to 500MPa, then almost remains constant. This phenomenon is contrary to the detector without underfill, where the stress is smaller with lower indium height. In the whole device, the maximal Von Mises stress appears in the InSb chip with 10μm, and the minimal Von Mises stress appears in the indium bump array with 16MPa, almost 1/10 of that in underfill encapsulate, where the stress is180MPa. It is noticed that when the Von Mises stress reaches minimum with some selected indium bump dimensions, its stress distribution is uniform and concentrated at all contacting areas, this is favorable to reduce the crack happening in InSb chip, and improve the yield.

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Rate dependent constitutive relations based on Anand model for 92.5Pb5Sn2.5Ag solder

Cited by 105 publications

References 21 publications

Reliability of the connections used in IGBT modules, in aeronautical environment

Reliability of the connections used in IGBT modules, in aeronautical environment

A critical review of constitutive models for solders in electronic packaging

Analysis of Structural Stress in 8􀀁8 InSb Array Detector

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