2000
DOI: 10.1109/5.867687
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Rationale and challenges for optical interconnects to electronic chips

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Cited by 1,041 publications
(479 citation statements)
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References 134 publications
(145 reference statements)
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“…Our results highlight how nanostructure growth can complement the rise of silicon photonics by populating these chips with high-performance and small-footprint active III-V devices. In doing so, extremely complex chip-scale optoelectronic functions will emerge with ramifications for myriad applications such as optical interconnects 3 , light detection and ranging 5 , threedimensional (3D) displays 47 , retinal prosthesis 39 and more. The vertical nature of the nanoresonators presented here may incidentally also facilitate future 3D integrated circuits 14 .…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…Our results highlight how nanostructure growth can complement the rise of silicon photonics by populating these chips with high-performance and small-footprint active III-V devices. In doing so, extremely complex chip-scale optoelectronic functions will emerge with ramifications for myriad applications such as optical interconnects 3 , light detection and ranging 5 , threedimensional (3D) displays 47 , retinal prosthesis 39 and more. The vertical nature of the nanoresonators presented here may incidentally also facilitate future 3D integrated circuits 14 .…”
Section: Resultsmentioning
confidence: 99%
“…By combining components that generate, detect and otherwise control light, PICs facilitate design of photonic architectures that prove far more powerful than any single photonic element alone. Already, they have sparked great interest for communications and computing technology 3,4 . Other rapidly emerging applications meanwhile include light detection and ranging 5 , optofluidics 6 and more.…”
mentioning
confidence: 99%
“…In the conversion from photons to electrons by photodetectors, this size incompatibility often leads to substantial penalties in power dissipation, area, latency and noise [1][2][3][4] . A photodetector can be made smaller by using a subwavelength active region; however, this can result in very low responsivity because of the diffraction limit of the light.…”
mentioning
confidence: 99%
“…Currently, intrachip, inter-chip, and inter-board connections are being investigated for manufacturing feasibility [59].…”
Section: Efficiency In Interconnection Complexitymentioning
confidence: 99%
“…Electrical wires suffer from induced noise and heat, which increases dramatically whenever wires are made thinner or placed closer together, or whenever the data throughput is increased [59]. As a direct consequence of their resistance-free pathways and noisereduced environments, optical systems have the potential to generate less waste heat and so consume less energy per computation step than electronic systems [14].…”
Section: Energy Efficiencymentioning
confidence: 99%