RD53 analog front-end processors for the ATLAS and CMS experiments at the High-Luminosity LHC

Gaioni, L.; Manghisoni, M.; Re, V.; Riceputi, E.; Traversi, G.; Barbero, M.; Fougeron, D.; Godiot, S.; Menouni, M.; Pangaud, P.; Rozanov, A.; Breugnon, P.; Bomben, M.; Calderini, G.; Crescioli, F.; Dortz, O. Le; Marchiori, G.; Dzahini, D.; Rarbi, F.; Gaglione, R.; Krüger, H.; Daas, M.; Dieter, Y.; Hemperek, T.; Huegging, F.; Moustakas, Konstantinos; Pohl, D.; Rymaszewski, P.; Standke, Mark; Vogt, M.; Wang, Tianqi; Wermes, N.; Karagounis, M.; Stiller, A.; Marzocca, C.; Robertis, G. De; Loddo, F.; Licciulli, F.; Andreazza, A.; Liberali, V.; Stabile, A.; Frontini, Luca; Bagatin, M.; Bisello, D.; Gerardin, Simone; Mattiazzo, Serena; Paccagnella, A.; Vogrig, D.; Bonaldo, Stefano; Bacchetta, N.; Casa, G. Della; Demaria, N.; Mazza, G.; Monteil, E.; Pacher, L.; Paterno, A.; Rivetti, A.; Rolo, Manuel; Ratti, L.; Vacchi, C.; Androsov, K.; Beccherle, R.; Magazzù, G.; Minuti, M.; Morsani, F.; Palla, F.; Poulios, S.; Bilei, G. M.; Menichelli, M.; Passeri, D.; Placidi, P.; Gajanana, D.; Gromov, V.; Eijk, B. Van; Kluit, R.; Vitkovskiy, A.; Benka, T.; Havránek, M.; Janoska, Z.; Marčišovský, M.; Neue, G.; Tomášek, L.; Kafka, V.; Vrba, V.; Vila, I.; Jiménez, E.; López-Morillo, E.; Palomo, F.R.; Muñoz, F.; Abbaneo, D.; Christiansen, J.; Emriskova, N.; Orfanelli, S.; Marconi, Silvana; Casas, L.M. Jara; Bell, S.; Prydderch, M.; Thomas, S.L.; Christian, David; Deptuch, G.; Fahim, Farah; Hoff, J.; Lipton, R.; Liu, T.; Zimmerman, T.; Miryala, Sandeep; Garcia-Sciveres, M.; Gnani, D.; Krieger, A.; Papadopoulou, K.; Heim, T.; Dimitrievska, A.; Carney, R. M. D.; Nachman, BP; Renteira, C.; Wallangen, V.; Hoeferkamp, M. R.; Seidel, S. C.

doi:10.22323/1.373.0021

Cited by 5 publications

(8 citation statements)

References 8 publications

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“…Some of the tested assemblies were irradiated to a fluence of ~10 16 n eq /cm 2 . The improved version of this ROC is called RD53B-CMS (also called CROC) [15,16]. It is the CMS final version of the chip and has a linear front-end [15].…”

Section: Sensor Readout Chip and Modulesmentioning

confidence: 99%

“…The use of the deep sub-micron CMOS technology and an efficient power architecture with a low supply voltage (1.2 V) demands a significant current level of about 2 A per ROC. In the serial power distribution design [17,18], a group of pixel channels share digital resources for buffering, control, and data formatting. The modules are powered in about 500 serial chains of up to 12 modules each.…”

Section: Power Architecturementioning

confidence: 99%

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CMS Phase-2 Inner Tracker Upgrade

Malik

2022

J. Phys.: Conf. Ser.

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The HL-LHC conditions of instantaneous peak luminosity up to 7.5x1034 cm-2s-1 and an integrated luminosity of the order of 300 fb-1/year is expected to result in 1 MeV neutron equivalent fluence of 2.3 x 1016 neq/cm2 and a total ionizing dose (TID) of 12 MGy (1.2 Grad) at the center of the CMS Experiment, where its innermost component, the Phase-2 Pixel Detector will be installed. This detector has to survive the above radiation dose, handle hit rates of 3.2 GHz/cm2 in the layers closest to the beam line, be able to track and separate particles in extremely dense collisions, deal with a pileup of 140-200 collisions per bunch crossing and have a high impact parameter resolution. This translates into a highly granular detector design with thinner sensors and smaller pixels, and a faster and more radiation hard electronics compared to the Phase-1 detector. This contribution reviews the Phase-2 upgrade of the (silicon-based) CMS Inner Tracker focusing on the features of the detector layout and on developments of pixelated devices.

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Section: Sensor Readout Chip and Modulesmentioning

confidence: 99%

Section: Power Architecturementioning

confidence: 99%

CMS Phase-2 Inner Tracker Upgrade

Malik

2022

J. Phys.: Conf. Ser.

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“…The basic functionalities of the RD53A chip and each of the three AFEs were previously verified and reported [22][23][24][25][26]. The objective of this work was to evaluate the three AFE designs against the CMS requirements, in terms of spurious hit rate, dead time, and radiation tolerance and to compare their performance.…”

Section: Trimmingmentioning

confidence: 99%

“…A significant improvement in time walk at the cost of a marginal increase in static current consumption was achieved by removing those two transistors. This led to a simpler TIA stage in the new design of the LIN AFE [31], for the next version of the chip, called RD53B [18].…”

Section: Lin Afe Slow Time Response Mitigationmentioning

confidence: 99%

Comparative evaluation of analogue front-end designs for the CMS Inner Tracker at the High Luminosity LHC

et al. 2021

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The CMS Inner Tracker, made of silicon pixel modules, will be entirely replaced prior to the start of the High Luminosity LHC period. One of the crucial components of the new Inner Tracker system is the readout chip, being developed by the RD53 Collaboration, and in particular its analogue front-end, which receives the signal from the sensor and digitizes it. Three different analogue front-ends (Synchronous, Linear, and Differential) were designed and implemented in the RD53A demonstrator chip. A dedicated evaluation program was carried out to select the most suitable design to build a radiation tolerant pixel detector able to sustain high particle rates with high efficiency and a small fraction of spurious pixel hits. The test results showed that all three analogue front-ends presented strong points, but also limitations. The Differential front-end demonstrated very low noise, but the threshold tuning became problematic after irradiation. Moreover, a saturation in the preamplifier feedback loop affected the return of the signal to baseline and thus increased the dead time. The Synchronous front-end showed very good timing performance, but also higher noise. For the Linear front-end all of the parameters were within specification, although this design had the largest time walk. This limitation was addressed and mitigated in an improved design. The analysis of the advantages and disadvantages of the three front-ends in the context of the CMS Inner Tracker operation requirements led to the selection of the improved design Linear front-end for integration in the final CMS readout chip.

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“…Three analog front-end designs with different architectures have been realized [17]. All were proven to satisfy the requirements of RD53A, working at thresholds of about 1,200 e − with a noise occupancy at 10 −6 level, a time-walk smaller than 25 ns and a charge deposition measurement with Time-of-Threshold (ToT) technique.…”

Section: Vertex Detectorsmentioning

confidence: 99%

The Impact of Microelectronics on High Energy Physics Innovation: The Role of 65 nm CMOS Technology on New Generation Particle Detectors

Demaria

2021

Front. Phys.

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The High Luminosity Large Hadron Collider (HL-LHC) at CERN will constitute a new frontier for the particle physics after the year 2027. Experiments will undertake a major upgrade in order to stand this challenge: the use of innovative sensors and electronics will have a main role in this. This paper describes the recent developments in 65 nm CMOS technology for readout ASIC chips in future High Energy Physics (HEP) experiments. These allow unprecedented performance in terms of speed, noise, power consumption and granularity of the tracking detectors.

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RD53 analog front-end processors for the ATLAS and CMS experiments at the High-Luminosity LHC

Cited by 5 publications

References 8 publications

CMS Phase-2 Inner Tracker Upgrade

CMS Phase-2 Inner Tracker Upgrade

Comparative evaluation of analogue front-end designs for the CMS Inner Tracker at the High Luminosity LHC

The Impact of Microelectronics on High Energy Physics Innovation: The Role of 65 nm CMOS Technology on New Generation Particle Detectors

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