2021
DOI: 10.1016/j.apsusc.2021.149391
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Reaction mechanisms of chlorine reduction on hydroxylated alumina in titanium nitride growth: First principles study

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Cited by 8 publications
(4 citation statements)
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“…The chemical reactivity of oxide or nitride surfaces can be strongly affected by the presence and coverage of OH (hydroxyl) or NH (amino) groups on the surfaces [35][36][37][38][39][40][41]. At process-relevant temperatures (ca.…”
Section: Resultsmentioning
confidence: 99%
“…The chemical reactivity of oxide or nitride surfaces can be strongly affected by the presence and coverage of OH (hydroxyl) or NH (amino) groups on the surfaces [35][36][37][38][39][40][41]. At process-relevant temperatures (ca.…”
Section: Resultsmentioning
confidence: 99%
“…In addition, density functional theory (DFT) was also attracting widespread interest in materials research, [29] which was a powerful tool for studying the structure, [30] interaction mechanisms [31] and electronic properties. [32][33][34][35] Shirazi et al [36,37] reported the Atomic ALD of MoS 2 by DFT, which the Mo-(NMe 2 ) 2 (N t Bu) 2 was the precursor and the H 2 S was the coreagent on Si(0001) surface.…”
Section: Introductionmentioning
confidence: 99%
“…The challenge presented by using a high voltage to speed up program/erase functions in memory devices creates a need for crystalline phases that can improve the conductivity of the metal gate in memory structures. Tungsten films are commonly used as metal gates due to their relatively high conductivity compared with other candidate metallic materials, which improves the performance of memory devices. , …”
Section: Introductionmentioning
confidence: 99%
“…Tungsten films are commonly used as metal gates due to their relatively high conductivity compared with other candidate metallic materials, which improves the performance of memory devices. 8,9 Growing tungsten films using atomic layer deposition (ALD) is the most successful process among elemental metal ALD processes. ALD-W uses the well-known tungsten precursor, WF 6 , and a reducing agent of borane or a silane compound.…”
Section: Introductionmentioning
confidence: 99%