2003
DOI: 10.1143/jjap.42.38
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Reactive Ion Beam Etching of In-Containing Compound Semiconductors in an Inductively Coupled Cl2/Ar Plasma

Abstract: PACS. 32.80Pj -Optical cooling of atoms; trapping. PACS. 32.80−t -Photon interactions with atoms.Abstract. -Ultracold cesium atoms are stored in a novel dipole-force trap, which provides long storage times of spin polarization and facilitates easy Stern-Gerlach selection. The trap consists of a far red-detuned standing light wave, oriented vertically in the field of gravity. By comparing the trapping of a single magnetic substate (F =4, mF =0) with the simultaneous storage of all sublevels, we measure the deca… Show more

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Cited by 3 publications
(2 citation statements)
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“…Chlorine is introduced into the chamber through a gas ring surrounding the sample holder ( Fig. 3.5) and reacts with indium on the surface to form InCl x compounds [72,73]. InCl x have a relatively low vapor pressure at room temperature [74].…”
Section: Chlorine Based Chemically Assisted Ion Beam Etchingmentioning
confidence: 99%
“…Chlorine is introduced into the chamber through a gas ring surrounding the sample holder ( Fig. 3.5) and reacts with indium on the surface to form InCl x compounds [72,73]. InCl x have a relatively low vapor pressure at room temperature [74].…”
Section: Chlorine Based Chemically Assisted Ion Beam Etchingmentioning
confidence: 99%
“…[1][2][3] These techniques include reactive ion etching ͑RIE͒, electron cyclotron resonance RIE, inductively coupled plasma RIE, and chemically assisted ion beam etching ͑CAIBE͒, with chlorine-containing gases most commonly used. A number of dry etching techniques and plasma chemistries have been reported for etching a wide range of III-V semiconductor materials.…”
Section: Introductionmentioning
confidence: 99%