Reactive-monolayer-assisted Thermal Nanoimprint Lithography with a Benzophenone-containing Trimethoxysilane Derivative for patterning Thin Chromium and Copper Films

Kubo, Shoichi; Ohtake, Tomoyuki; Kang, Eui Chul; Nakagawa, Masaru

doi:10.2494/photopolymer.23.83

Cited by 12 publications

(16 citation statements)

References 10 publications

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“…Polymer resists have been utilized as an etching mask for patterning metal thin films for decades . In view of the ability to generate uniform, high‐resolution, and high‐quality nanopolymers over large areas, we believe that DNL can be further developed as a low‐cost desktop tool for the massively parallel fabrication of metal nanostructures, addressing the aforementioned challenges.…”

Section: Photovoltaic Parameters Of the Fabricated Oscs Based On Varimentioning

confidence: 99%

Large‐Area Patterning of Metal Nanostructures by Dip‐Pen Nanodisplacement Lithography for Optical Applications

Chen

Wei

Zhou

et al. 2017

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Au nanostructures are remarkably important in a wide variety of fields for decades. The fabrication of Au nanostructures typically requires time-consuming and expensive electron-beam lithography (EBL) that operates in vacuum. To address this challenge, this paper reports the development of massive dip-pen nanodisplacement lithography (DNL) as a desktop fabrication tool, which allows high-throughput and rational design of arbitrary Au nanopatterns in ambient condition. Large-area (1 cm ) and uniform (<10% variation) Au nanostructures as small as 70 nm are readily fabricated, with a throughput 100-fold higher than that of conventional EBL. As a proof-of-concept of the applications in the opitcal field, we fabricate discrete Au nanorod arrays that show significant plasmonic resonance in the visible range, and interconnected Au nanomeshes that are used for transparent conductive electrode of solar cells.

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Section: Photovoltaic Parameters Of the Fabricated Oscs Based On Varimentioning

confidence: 99%

Large‐Area Patterning of Metal Nanostructures by Dip‐Pen Nanodisplacement Lithography for Optical Applications

Chen

Wei

Zhou

et al. 2017

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“…We demonstrated reactive-monolayer-assisted thermal nanoimprint lithography (R-TNIL) as an advanced TNIL technique [5,6]. In R-TNIL, a surface of a metal-plated substrate is modified with a photoreactive monolayer (PrM) having a benzophenone moiety and then a resist layer of thermoplastic polymer polystyrene (PS).…”

Section: Introductionmentioning

confidence: 99%

“…This technique is applicable for patterning of other metal layers of Cr and Cu by selecting a trimethoxysilyl group as a reaction site to substrate surfaces with the native oxide layer [6].…”

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confidence: 99%

Reactive-monolayer-assisted Thermal Nanoimprint Lithography

Kubo

Nakagawa

2012

J. Photopol. Sci. Technol.

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This article gives an overview of reactive-monolayer-assisted thermal nanoimprint lithography (R-TNIL) for the fabrication of patterned metal thin layers on substrates by simple wet etching using a thermoplastic polymer resist layer assisted by photochemically grafted polymer layer. A photoreactive monolayer causing a photoinduced graft reaction on the metal surface anchors interfacial resist polymers, resulting in the suppression of thermally induced dewetting of the resist layer and the improvement of lateral pattern resolution of metal thin layers. Line widths of metal patterns could be tuned by controlled side etching. Enhanced adhesion of resist layers was revealed by lateral force curves measured by scanning probe microscopy. It was demonstrated as an application that transparent conductive substrates having metal mesh structures were fabricated by R-TNIL. We also demonstrated R-TNIL involving electrodeposition, which allowed the preparation of metal patterns with controlled aspect ratio. It was proved that the photoreactive monolayer played important roles to fabricate submicrometer patterns of metal thin layers.

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“…23 Layered Au structures accumulated three-dimensionally were made by multiple cycles of NIL and lift-off processes or laminating an ultraviolet-cured layer of Au structures fabricated in advance in a layer-by-layer manner by NIL and lift-off processes. 24,25 In general, selective metallization can be carried out by dry etching, 26 wet etching, [27][28][29] and electrodeposition. [30][31][32][33][34] Among these, chemical electrodeposition is a promising option for fabricating metal structures with high size fidelity, because metals grow electrochemically along walls at concave regions of resist patterns.…”

Section: Introductionmentioning

confidence: 99%

Fabrication of Au nanorod and nanogap split-ring structures by reactive-monolayer-assisted thermal nanoimprint lithography involving electrodeposition

Tomioka

Kubo

Nagase

et al. 2012

Journal of Vacuum Science &Amp; Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phen

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Au nanorods and Au nanogap split-ring (SR) structures were fabricated to investigate the ability of wet etching and Ar ion milling processes to remove an underlying Au electrode layer on shapes of electrodeposited Au structures. A reactive-monolayer-assisted thermal nanoimprint lithography process involving Au electrodeposition was used to make 100 nm × 500 nm Au nanorods and Au nanogap SR structures with widths of 125 nm and two 20 nm gaps. Individual Au bump structures were successfully demonstrated on transparent silica substrates by Ar ion milling and subsequent Cr wet etching. Au nanorod and nanogap SR structures were obtained almost uniformly over a 100-μm square area, which was sufficient to investigate their optical properties. The array comprising electrodeposited Au nanorods showed an anisotropic absorption band, attributable to a transverse plasmon band at wavelengths ranging from 500 to 700 nm when an incident light was linearly polarized perpendicular to the long axis of Au nanorods.

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Reactive-monolayer-assisted Thermal Nanoimprint Lithography with a Benzophenone-containing Trimethoxysilane Derivative for patterning Thin Chromium and Copper Films

Cited by 12 publications

References 10 publications

Large‐Area Patterning of Metal Nanostructures by Dip‐Pen Nanodisplacement Lithography for Optical Applications

Large‐Area Patterning of Metal Nanostructures by Dip‐Pen Nanodisplacement Lithography for Optical Applications

Reactive-monolayer-assisted Thermal Nanoimprint Lithography

Fabrication of Au nanorod and nanogap split-ring structures by reactive-monolayer-assisted thermal nanoimprint lithography involving electrodeposition

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