Abstract:"Plasma Plating" as discussed in this paper is an otherwise conventional evaporation process in which coatings are deposited on substrate surfaces immersed in an intense plasma. The deposition process is characterized by very high ion currents and relatively low ion energies. A similar process has been called Ion Plating by Pulker, et al1, but since this term is associated in many people’s minds with the relatively low-current, high-ion-energy process developed by Mattox2, we have elected not to use it.
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