2023
DOI: 10.1109/tie.2022.3176284
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Real-Time Average Junction Temperature Estimation for Multichip IGBT Modules With Low Computational Cost

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Cited by 21 publications
(3 citation statements)
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“…One of the important research perspectives is to investigate the thermal transient responses. The typical applications are such as to obtain the thermal model parameters [5], [6], identify the inner structure [7], [8], analyze failure modes non-destructively [9], and estimate the junction temperature [10]- [12].…”
Section: Introductionmentioning
confidence: 99%
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“…One of the important research perspectives is to investigate the thermal transient responses. The typical applications are such as to obtain the thermal model parameters [5], [6], identify the inner structure [7], [8], analyze failure modes non-destructively [9], and estimate the junction temperature [10]- [12].…”
Section: Introductionmentioning
confidence: 99%
“…method, the framework of the NID method has been successfully standardized in [17] and commercialized in [18]. The majority of publications about the NID method are focused on a variety of its applications [5], [6], [9], [10], [14]. The limitations or challenges of the method itself are rarely discussed.…”
Section: Introductionmentioning
confidence: 99%
“…There is a serious need for fast and easily implementable thermal model. A computationally fast 2D average thermal model is proposed in [44]. However, several factors limit this method such as neglecting thermal coupling in critical layers and module-to-module thermal coupling and the impact of TIM and integrated heat sink.…”
Section: Introductionmentioning
confidence: 99%