Real-time monitoring of the interelectrode gap during electrochemical machining processes using a smart machine tool equipped with an optical fiber Fabry-Pérot interferometer: Principle and application

Zhou, Fengfeng; Chen, Siying; Fu, Xingyu; Jun, Martin B.G.

doi:10.1016/j.ymssp.2024.111245

Mechanical Systems and Signal Processing

2024

DOI: 10.1016/j.ymssp.2024.111245

|View full text |Cite

Real-time monitoring of the interelectrode gap during electrochemical machining processes using a smart machine tool equipped with an optical fiber Fabry-Pérot interferometer: Principle and application

Fengfeng Zhou,

Siying Chen,

Xingyu Fu

et al.

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...

Citation Types

Supporting

Mentioning

Contrasting

Year Published

2024

2025

Publication Types

Select...

Article2

Relationship

Self Cite0

Independent2

Authors

Journals

Cited by 2 publications

References 27 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

Real-time monitoring of thin film thickness and surface roughness using a single mode optical fiber

Zhou,

Chen,

Akin

et al. 2025

Mechanical Systems and Signal Processing

View full text Add to dashboard Cite

Real-time monitoring of thin film thickness and surface roughness using a single mode optical fiber

Zhou,

Chen,

Akin

et al. 2025

Mechanical Systems and Signal Processing

View full text Add to dashboard Cite

Three-Dimensional Profile Reconstruction and Internal Defect Detection of Silicon Wafers Using Cascaded Fiber Optic Fabry–Pérot Interferometer and Leaky Field Detection Technologies

Zhou,

Fu,

Chen

et al. 2024

Journal of Manufacturing Science and Engineering

View full text Add to dashboard Cite

Wafer quality control is one of the important processes to improve the yield rate of semiconductor products. Profile quality and defects in the wafer are two key factors that should be taken into consideration. In this research, we introduce a method that measures the profile of the upper surface and the thickness of the wafer at the same time using an optical fiber cascaded Fabry-Pérot interferometer working at wavelength of 1550 nm. Therefore, the 3D profile of the wafer can be reconstructed directly. Testing results show that both accuracy and precision of the Fabry-Pérot interferometer are within a nanometer scale. Defects, especially those embedded inside the wafer, will be detected by monitoring the leaky field with treating wafers as slab waveguides. With the leaky field detection, defects on the lower surface of the wafer were successfully detected by monitoring the leaky field above the upper surface of the wafer. Compared with traditional methods such as radiographic testing (RT) or computed tomography (CT) testing, the proposed methods provide a cost-effective alternative for wafer quality evaluation.

show abstract

scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.

Contact Info

customersupport@researchsolutions.com

10624 S. Eastern Ave., Ste. A-614

Henderson, NV 89052, USA

This site is protected by reCAPTCHA and the Google Privacy Policy and Terms of Service apply.

Blog Terms and Conditions API Terms Privacy Policy Contact Cookie Preferences Do Not Sell or Share My Personal Information

Made with 💙 for researchers

Part of the Research Solutions Family.

Real-time monitoring of the interelectrode gap during electrochemical machining processes using a smart machine tool equipped with an optical fiber Fabry-Pérot interferometer: Principle and application

Cited by 2 publications

References 27 publications

Real-time monitoring of thin film thickness and surface roughness using a single mode optical fiber

Real-time monitoring of thin film thickness and surface roughness using a single mode optical fiber

Three-Dimensional Profile Reconstruction and Internal Defect Detection of Silicon Wafers Using Cascaded Fiber Optic Fabry–Pérot Interferometer and Leaky Field Detection Technologies

Contact Info

Product

Resources

About