“…Nevertheless, optical-based sensors (e.g., optical emission spectroscopy (OES) and laser interferometry (LIF), see [15], [26], [27] and references therein) have been invented to measure various chamber-status process variables (or in-situ variables) such as temperature and pressure. This, together with the development of appropriate models that relate in-situ variables to the process metrics, leads to the integrated RtR and real-time control strategy [6], [8], [26], which can be designed in two steps. First, the RtR control uses these models to determine in-situ process variables corresponding to the desired critical wafer parameters.…”