2015
DOI: 10.1108/ssmt-12-2014-0023
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Realistic warpage evaluation of printed board assembly during reflow process

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Cited by 22 publications
(7 citation statements)
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“…It is extremely difficult to generate the geometric model owing to the complexity of the copper patterns. To alleviate this difficulty, homogenization of the complex copper layer has been conducted in existing works [ 16 , 17 , 18 , 19 ]. This method imposes equivalent material properties on the domain instead of modeling the cladding as it is.…”
Section: Methodsmentioning
confidence: 99%
“…It is extremely difficult to generate the geometric model owing to the complexity of the copper patterns. To alleviate this difficulty, homogenization of the complex copper layer has been conducted in existing works [ 16 , 17 , 18 , 19 ]. This method imposes equivalent material properties on the domain instead of modeling the cladding as it is.…”
Section: Methodsmentioning
confidence: 99%
“…An optimised thermal profile and a well-controlled heating factor [practically the integral of the soldering profile above the melting point (Veselý et al , 2018)] are important for optimising the quality and reliability of the resulting joints. Overall, a proper soldering profile is important to enable best joint quality without typical failures [shorts, balling, voiding, microstructural optimizations (Lee, 2001)], and to avoid thermomechanical failures [CTE mismatch, warpage, shrinkage (Chung and Kwak, 2015)].…”
Section: Introductionmentioning
confidence: 99%
“…The most common assembly method for connecting electronic components to printed circuit boards (PCB) is reflow soldering technology. Depositing solder paste by stencil printing (Lau et al , 2016) onto the solder pads of the PCB (Chung and Kwak, 2015) is one of the most crucial steps of this technology (Skwarek et al , 2015); almost 60 per cent of soldering failures can be traced back to the printing process (Tsai, 2008). The process of stencil printing can be divided into two main parts: the print stroke of the solder paste and the time-gap between the strokes.…”
Section: Introductionmentioning
confidence: 99%