Realization of a microelectrofluidic platform

Ng, Sum Huan; Wang, Z F; Shi, Z. F.; Tjeung, R. T.; Lok, B. K.

doi:10.1088/1742-6596/34/1/061

Cited by 2 publications

(2 citation statements)

References 2 publications

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“…To date, many different bonding technologies have been applied (Boehm et al 2006;Kim and Najafi 2003;Ng et al 2006;Niklaus et al 2006;Venditti et al 2006), among which adhesive wafer bonding is a cost-effective and low-temperature method suitable for microfluidics.…”

Section: Introductionmentioning

confidence: 99%

Wafer-level BCB bonding using a thermal press for microfluidics

2008

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Benzocyclobutene (BCB) is a thermosetting polymer that can form microfluidics and bond top and bottom layers of the microfluidics at the same time, and yields high repeatability and high bonding strength. This paper reports using photosensitive BCB to fabricate microfluidics and to bond with a thermal press for 4 in. wafers. By optimizing the parameters for pattern development and using a three-stage temperature and pressure increment BCB bonding, we realize the whole wafer glassSi or glass-glass bonding in thermal press without any crack. The wafer-level bonding shows a bonding percentage above 70%, a tensile stress above 4.94 MPa, and a bonding repeatability over 95%. Furthermore, the bonding is compatible with thick electrode integration, that microfluidics with 380 nm thick electrodes underneath can be well-bonded. Our bonding method much reduces the cost compared with bonding BCB in a wafer bonding machine.

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Section: Introductionmentioning

confidence: 99%

Wafer-level BCB bonding using a thermal press for microfluidics

2008

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“…Ultrasonic machining [6] and highenergy beam machining [7,8], such as a laser beam or focused ion beam machining, have been often used. In a microor nano-imprinting method, heated materials are pressed to molds fabricated in a preprocess [9,10]. The mechanical strength restricts the tip diameter of the sharp cutting tool in the mechanical working process.…”

Section: Introductionmentioning

confidence: 99%

Machining a glass rod with a lathe-type electro-chemical discharge machine

Furutani

Maeda²

2008

J. Micromech. Microeng.

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This paper deals with the performance of electro-chemical discharge machining (ECDM) of a revolving glass rod. ECDM has been studied for machining insulating materials such as glass and ceramics. In conventional ECDM, an insulating workpiece is dipped in an electrolyte as a working fluid and a tool electrode is pressed on the surface with a small load. In the experiments, a workpiece was revolved to provide fresh working fluid into a gap between the tool electrode and the workpiece. A soda lime grass rod was machined with a thin tungsten rod in NaCl solution. The applied voltage was changed up to 40 V. The rotation speed was set to 0, 0.3, 3 and 30 min −1 . Discharge was observed over an applied voltage of 30 V. The width and depth of the machined grooves and the surface roughness of their bottom were increased with increase of the applied voltage. Although the depth of machining at 3 min −1 was the same as that at 30 min −1 , the width and roughness at 30 min −1 were smaller than those at 3 min −1 . Moreover, because the thickness of vaporization around the tool electrode was decreased with increase of the rotation speed, the width of the machined groove became smaller.

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Realization of a microelectrofluidic platform

Cited by 2 publications

References 2 publications

Wafer-level BCB bonding using a thermal press for microfluidics

Wafer-level BCB bonding using a thermal press for microfluidics

Machining a glass rod with a lathe-type electro-chemical discharge machine

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