Recent Advance in Low‐Dielectric‐Constant Organosilicon Polymers

Hou, Jiaren; Sun, Jing; Fang, Qiang

doi:10.1002/cjoc.202300125

Cited by 13 publications

(8 citation statements)

References 111 publications

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“…Lower polarity of polymer backbone has a significant impact on dielectric properties, as poly(bisS-A) has the highest ε and tan δ among all the hydroxyl-free epoxy thermoplastic samples due to the sulfone groups on its backbone. It is noteworthy that poly(bisF-A) has a remarkably low ε of 2.26 at 1 MHz, lower than most recently reported hydroxyl-free epoxy resins (Table ), which suggests that the dielectric constant can be reduced by introducing lower polarizable chemical bonds − (such as C–F in this structure) on the backbones. The dielectric constant property is the external manifestation of internal microcosmic polarization phenomenon, so the internal polarization mechanism should be discussed. , As Li et al reported that ε generally goes down with increases in the curing degree of thermoset epoxy resin with polarized backbone due to decrease of local mobility, we speculated that lower ε of a linear nonpolar polymer can attribute to a higher degree of freedom of linear polymer chains.…”

Section: Resultsmentioning

confidence: 56%

Hydroxyl-Free Epoxy Thermoplastics from Active Esters with Low Dielectric Constant and Water Sorption

Zhang,

Peng,

Wang

et al. 2024

ACS Appl. Electron. Mater.

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Fabricating epoxy resins low in both dielectric properties and moisture absorption is of emerging need but challenging, especially in the application of microelectronic packaging materials that are intensively exposed to harsh environments. In this work, a series of diphenols of different substituent positions and groups blocked with ester groups were copolymerized with diglycidyl ether of bisphenol A (DGEBA)based epoxy resin to synthesize high-molecular-weight hydroxylfree epoxy thermoplastics (phenoxy resins). Remarkably low dielectric constants down to 2.26 at 1 MHz and low dielectric losses were found in these hydroxyl-free epoxy thermoplastics, which also showed excellent hydrophobicity compared with those of epoxy thermosets and commercialized epoxy thermoplastic. The migration of ester groups in the polymerization process was studied by a series of model reactions, indicating that the reaction mainly undergoes an associative mechanism under catalysis of the imidazole derivative. In addition, the polymers demonstrated good thermal stability, while thermal properties can be easily modulated by changing the substituent group of phenolic ester monomers. In short, these hydroxyl-free epoxy thermoplastics could be a promising candidate for antimoisture microelectronic packing materials and have versatile applications.

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Section: Resultsmentioning

confidence: 56%

Hydroxyl-Free Epoxy Thermoplastics from Active Esters with Low Dielectric Constant and Water Sorption

Zhang,

Peng,

Wang

et al. 2024

ACS Appl. Electron. Mater.

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“…The epoxy monomers with low‐molecular polarization and polarized molecular density are synthesized by introducing the low polarizable chemical bonds (such as the CF, 35 CSi, 36 and OSi 37 bonds) or the non‐polar large volume groups (such as the polyhedral oligomeric silsesquioxane [POSS] 38 and adamantane 39 ).…”

Section: Research Process Of Ultra‐low Dielectric Constant Epoxy Resinsmentioning

confidence: 99%

A mini‐review of ultra‐low dielectric constant intrinsic epoxy resins: Mechanism, preparation and application

Wu,

Fan,

Wang

et al. 2023

Polymers for Advanced Techs

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Epoxy resins are widely utilized in electronics, electrical components, and communication equipment for polymer‐based wave‐transparent composites. However, the dielectric constant (ε) and dielectric loss (tanδ) of common epoxy resins are relatively high (ε for 3.8–4.2; tanδ for 0.018–0.025), and the corresponding impact resistance is poor. Thus, it cannot meet the requirements of advanced microelectronic materials. And the epoxy resins prepared by filling the inorganic fillers are difficult to combine the low ε with good machining performance. The ε and tanδ of intrinsic epoxy resins can be decreased by the synthesis of epoxy monomers and curing agents and the optimization of the final curing network. Meanwhile, the use of some special processing methods, such as the electrospinning technology, is also conducive to reducing the ε and tanδ values of final epoxy‐cured resins. The factors affecting the dielectric properties of epoxy‐cured resins, and the common methods to decrease the ε value of epoxy‐cured resins are reviewed in this article. Then, the design, synthesis and research progress of ultra‐low ε epoxy resins are investigated with the relevant academic results. Finally, the development trends and application prospects of the ultra‐low ε epoxy resins are discussed.

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“…Dielectric loss is the phenomenon of energy dissipation in a dielectric material due to changes in an applied electric field. [ 24,25 ] It is typically described by the loss tangent, defined as the ratio of the imaginary part to the real part of the dielectric constant. It is generally represented by the formula(): [ 11 ]

\begin{equation}{\mathrm{tan}}\delta \ = \frac{{{\mathrm{\varepsilon ^{\prime\prime}}}}}{{{\mathrm{\varepsilon }}^{\prime}}}\ \end{equation}

…”

Section: Introductionmentioning

confidence: 99%

The Recent Advances of Polymer–POSS Nanocomposites With Low Dielectric Constant

Miao,

Zhan,

Liao

et al. 2024

Macromol. Rapid Commun.

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This study provides a comprehensive overview of the preparation methods for polyhedral oligomeric silsesquioxane (POSS) monomers and polymer/POSS nanocomposites. It focuses on the latest advancements in using POSS to design polymer nanocomposites with reduced dielectric constants. The study emphasizes exploring the potential of POSS, either alone or in combination with other materials, to decrease the dielectric constant and dielectric loss of various polymers, including polyimides, bismaleimide resins, poly(aryl ether)s, polybenzoxazines, benzocyclobutene resins, polyolefins, cyanate ester resins, epoxy resins, and more. Additionally, the research investigates the impact of incorporating POSS on improving the thermal properties, mechanical properties, surface properties, and other aspects of these polymers. The entire study is divided into two parts, discussing systematically the role of POSS in reducing dielectric constants during the preparation of POSS composites using both physical blending and chemical synthesis methods. The goal of this research is to provide valuable strategies for designing a new generation of low dielectric constant materials suitable for large‐scale integrated circuits in the semiconductor materials domain.This article is protected by copyright. All rights reserved

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Recent Advance in Low‐Dielectric‐Constant Organosilicon Polymers

Cited by 13 publications

References 111 publications

Hydroxyl-Free Epoxy Thermoplastics from Active Esters with Low Dielectric Constant and Water Sorption

Hydroxyl-Free Epoxy Thermoplastics from Active Esters with Low Dielectric Constant and Water Sorption

A mini‐review of ultra‐low dielectric constant intrinsic epoxy resins: Mechanism, preparation and application

The Recent Advances of Polymer–POSS Nanocomposites With Low Dielectric Constant

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