2022
DOI: 10.1016/j.ceramint.2022.02.050
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Recent advances and perspectives in carbon-based fillers reinforced Si3N4 composite for high power electronic devices

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Cited by 23 publications
(4 citation statements)
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“…Therefore, diamonds have been extensively studied for applications in electronic devices [15], thermal management, diffractive optical elements [16], and biomedicine [17]. In most applications, carbon nanomaterials are grown on substrates, such as silicon carbide, graphite, platinum, and nickel [18][19][20]. Existing evidence suggests that the heterostructure of graphene and diamond is beneficial for many applications.…”
Section: Introductionmentioning
confidence: 99%
“…Therefore, diamonds have been extensively studied for applications in electronic devices [15], thermal management, diffractive optical elements [16], and biomedicine [17]. In most applications, carbon nanomaterials are grown on substrates, such as silicon carbide, graphite, platinum, and nickel [18][19][20]. Existing evidence suggests that the heterostructure of graphene and diamond is beneficial for many applications.…”
Section: Introductionmentioning
confidence: 99%
“…Hence, processing must be done carefully to ensure the formation of suitable formulations, as it affects the final product quality. 23…”
Section: Introductionmentioning
confidence: 99%
“…Hence, Environmental Science: Water Research & Technology Paper processing must be done carefully to ensure the formation of suitable formulations, as it affects the final product quality. 23 Graphene has a two-dimensional planar structure and is hydrophobic, which improves the mechanical, thermal, electrical, and functional properties of the membranes. 24 However, the inherent hydrophobicity of graphene and graphite makes them less attractive for the fabrication of hydrophilic membranes for oily wastewater treatment.…”
Section: Introductionmentioning
confidence: 99%
“…Moreover, Si 3 N 4 ceramics were predicted to have a theoretical thermal conductivity of 200–320 W·m −1 ·k −1 at room temperature in 1995 3 . Consequently, Si 3 N 4 ceramics have attracted considerable attention as a potential heat dissipation substrate material for high‐power electronic devices 4,5 . Therefore, the development of Si 3 N 4 ceramics with excellent mechanical properties and high thermal conductivity will undeniably promote the industrial applications of Si 3 N 4 ceramics as structural and functional materials.…”
Section: Introductionmentioning
confidence: 99%