2024
DOI: 10.31613/ceramist.2024.27.2.06
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Recent Advances in CMP Slurries: Composition and Analysis Perspectives

Kiho Bae,
Junhwan Yim,
Kyungtae Lee
et al.

Abstract: Chemical Mechanical Planarization (CMP) slurries play key role during planarization process in advanced semiconductor manufacturing, serving to planarize wafer surfaces and minimize unevenness in multi-layered device scheme. This paper provides a comprehensive review of the composition of CMP slurries and the analytical methods used to evaluate their components. The primary constituents of CMP slurries―abrasive particles, chemical agents, and various additives―are examined in detail, highlighting their roles a… Show more

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