Recent advances in the synthesis of copper-based nanoparticles for metal–metal bonding processes

Kobayashi, Yoshio; Yasuda, Yusuke; Morita, Toshiaki

doi:10.1016/j.jsamd.2016.11.002

Cited by 21 publications

(12 citation statements)

References 82 publications

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“…Accordingly, this mechanism was not considered to dominate in the present work. A shear strength as high as 41.7 MPa at 3.0 M was achieved, the strongest among our works on Cu-Cu bonding [48][49][50][51][52][53][54][55][56]. This result supported the implication obtained by the SEM observation (Fig.…”

Section: Bonding Propertysupporting

confidence: 87%

“…The methods are quite simple, safe, and do not impart a high environmental load. From this viewpoint, our research group has produced metallic copper particles produced in aqueous solution, and studied metal-metal bonding using the particles [48][49][50][51][52][53][54][55][56].…”

Section: Introductionmentioning

confidence: 99%

“…If the aggregation occurs for the metallic copper particles, the particles no longer maintain their excellent bonding ability because of the increase in their size. Therefore, in our previous work, colloid solutions of metallic copper particles have been prepared at low concentrations to prevent the species from aggregating: the copper concentration in the as-prepared particle colloid solutions, prepared by reducing copper ions with hydrazine in an aqueous medium, was as low as 10 −2 M [48][49][50][51][54][55][56]. The mass production of fillers is required for their practical use.…”

Section: Introductionmentioning

confidence: 99%

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Preparation of high-concentration colloid solutions of metallic copper particles and their use in metal–metal bonding processes

et al. 2019

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A high-concentration colloid solution of metallic copper nanoparticles was prepared by the reduction of copper ions in aqueous solutions, and the nanoparticles were used to study metal-metal bonding. The colloid solution of metallic copper nanoparticles was prepared by mixing an aqueous solution of CuCl 2 and an aqueous solution of hydrazine (reductant) in the presence of citric acid and n-hexadecyltrimethylammonium bromide (stabilizers) at a final copper concentration as high as 0.1 M. The copper-particle size was ca. submicrometer. Many tiny particles with sizes of ca. 10-20 nm were deposited on the submicron-sized particles at high hydrazine concentrations. The tiny particles were considered to be produced through the growth of particle nuclei generated at the final reaction stage by residual hydrazine derived from the high hydrazine concentration. Metallic-copper discs were successfully bonded by annealing at 400 °C and a pressure of 1.2 MPa for 5 min in hydrogen gas with the help of the metallic-copper particles. The shear strength of the bonded copper discs was then measured. The highest shear strength of 41.7 MPa was recorded for the tiny particles/ immobilized particles, which could be explained by the low melting points of the tiny particles and the increase in bulk density provided by the dominant incorporation of the tiny particles into voids between the submicron-sized particles.

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Section: Bonding Propertysupporting

confidence: 87%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Preparation of high-concentration colloid solutions of metallic copper particles and their use in metal–metal bonding processes

et al. 2019

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“…Polymer–Cu–nanoparticles, being the convenient platform for metallic, antibacterial copper have been formed by a wide array of methods, including chemical, biological synthesis methods, and physical methods [ 49 , 50 , 51 , 52 , 53 ], including the magnetic sputtering method [ 54 , 55 ]. This method exhibits an especially convenient character—it is simple and ecofriendly, allowing deposition of the required amount of deposited metal in function of the time applied.…”

Section: Introductionmentioning

confidence: 99%

Deposition of Copper on Poly(Lactide) Non-Woven Fabrics by Magnetron Sputtering—Fabrication of New Multi-Functional, Antimicrobial Composite Materials

et al. 2020

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The paper presents the method of synthesis; physico-technical and biological characterization of a new composite material (PLA–Cu0) obtained by sputter deposition of copper on melt-blown poly(lactide) (PLA) non-woven fabrics. The analysis of these biofunctionalized non-woven fabrics included: ultraviolet/visible (UV/VIS) transmittance; scanning electron microscopy/energy-dispersive spectroscopy (SEM/EDS); attenuated total reflection Fourier transform infrared (ATR-FTIR) spectroscopy; ability to block UV radiation; filtration parameters (air permeability); and tensile testing. The functionalized non-woven composite materials were subjected to antimicrobial tests against colonies of Gram-negative (Escherichia coli), Gram-positive (Staphylococcus aureus) bacteria and antifungal tests against the Chaetomium globosum fungal mould species. The antibacterial and antifungal activity of PLA–Cu0 suggests potential applications as an antimicrobial material.

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“…This review is an effort to support the already documented data of other researchers [39][40][41]. There are some good reviews that can be found on a similar topic where some researchers focused on cupper nanoparticle synthesis using chemical treatment option with summarizing its ap plication in the field of catalysis or used as a filler in metal-metal bonding [42,43]. Supported metal nanoparticles with particular focus on CuNP and its application on its catalytic performance is described in great detail [44].…”

mentioning

confidence: 86%

An Overview of Strategic Non-Biological Approaches for The Synthesis of Cupper Nanoparticles

Munir

Gul

2021

Acta Chemica Malaysia

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Metal Nanoparticles show specific physical and chemical properties attributed to its small size and high surface area to volume ratio. These chemical and physical properties using different strategies and conditions enhance its biological application especially in the field of medicine. Earth abundant and cheap cupper metal is the essential element in many processes and has been used as a focus element to synthesize nanoparticles by different methods using new technology, which are being broadly classified as biological methods that includes green synthesis, microorganism etc. and the non-biological synthesis which includes chemical and Physical methods. Thus, the imperative need to synthesize cupper nanomaterial that are economic and efficient is necessary. This review have briefly described the modern methods to synthesize nanoparticles particularly focusing on the non-biological methods of cupper nanoparticles. An overview of current methodologies that are used for cupper nanoparticle mainly chemical reduction using organic and inorganic solvents, Reverse micelle, microemulsion, polyol method and several physical methods such as vapor condensation, photo irradiation and plasma synthesis methods are discussed.

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Recent advances in the synthesis of copper-based nanoparticles for metal–metal bonding processes

Cited by 21 publications

References 82 publications

Preparation of high-concentration colloid solutions of metallic copper particles and their use in metal–metal bonding processes

Preparation of high-concentration colloid solutions of metallic copper particles and their use in metal–metal bonding processes

Deposition of Copper on Poly(Lactide) Non-Woven Fabrics by Magnetron Sputtering—Fabrication of New Multi-Functional, Antimicrobial Composite Materials

An Overview of Strategic Non-Biological Approaches for The Synthesis of Cupper Nanoparticles

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