2020
DOI: 10.3390/mi11040390
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Recent Advances on Thermal Management of Flexible Inorganic Electronics

Abstract: Flexible inorganic electronic devices (FIEDs) consisting of functional inorganic components on a soft polymer substrate have enabled many novel applications such as epidermal electronics and wearable electronics, which cannot be realized through conventional rigid electronics. The low thermal dissipation capacity of the soft polymer substrate of FIEDs demands proper thermal management to reduce the undesired thermal influences. The biointegrated applications of FIEDs pose even more stringent requirements on th… Show more

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Cited by 5 publications
(3 citation statements)
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References 90 publications
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“…The fracture toughness of LM/PBSE with different matrix components and Φ LM is also investigated by the crack propagation test. , During the test, the specimen with an initial crack is stretched at a constant strain rate of 0.01 s –1 , and cracks for all specimens propagated perpendicular to the loading direction, showing typical penetrating crack morphologies (SI Figure S9). Notably, the critical strain (ε c ) is defined as the strain until the LM/PBSE was destroyed.…”
Section: Results and Discussionmentioning
confidence: 99%
“…The fracture toughness of LM/PBSE with different matrix components and Φ LM is also investigated by the crack propagation test. , During the test, the specimen with an initial crack is stretched at a constant strain rate of 0.01 s –1 , and cracks for all specimens propagated perpendicular to the loading direction, showing typical penetrating crack morphologies (SI Figure S9). Notably, the critical strain (ε c ) is defined as the strain until the LM/PBSE was destroyed.…”
Section: Results and Discussionmentioning
confidence: 99%
“…The development of electronic skin has led to the necessity of long-term conformally attached devices to collect physiological information [ 31 , 33 , 34 ], which has highlighted the importance of comfort in the design of electronic skin [ 35 ]. The uncomfortable sensations induced by electronic skin can be attributed to the mechanical [ 36 , 37 , 38 , 39 ], thermal [ 40 , 41 , 42 , 43 , 44 , 45 , 46 ], and electrical [ 47 , 48 ] stimuli during operation. On the one hand, these stimuli comprise the on-demand therapeutics applied by the electronic skin, which is able to reduce long-term medical costs and health risks.…”
Section: Introductionmentioning
confidence: 99%
“…The poor heat dissipation capacity of soft polymer substrates, which have a thermal conductivity on the order of 0.1 W m −1 K −1 , is much lower than that of conventional silicon substrates (∼100 W m K −1 ) and may induce a large temperature increase in the functional components, causing device performance degradation [45]. Therefore, thermal management has become one of the most important challenges for polymer-based soft electronic devices [46]. This review aims to draw a mid-term roadmap regarding nanotechnology-based approaches for the printing of soft electronics on polymeric materials, especially stretchable ones.…”
Section: Introductionmentioning
confidence: 99%