Recent aspects concerning DC reactive magnetron sputtering of thin films: a review

Safi, I.

doi:10.1016/s0257-8972(00)00566-1

Cited by 459 publications

(166 citation statements)

References 64 publications

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“…For tribological and hard coating applications, the coating must possess good wear resistance, high hardness resistance and corrosion resistant properties, as reported in the literature [1][2][3][4][5][6][7][8]. To deposit the hard coating, sputtering is normally used from the available processes because of its high deposition rate, thin compound nature with controlled stoichiometry, simplicity and cost-effectiveness compared to the radio frequency (RF) system.…”

Section: Introductionmentioning

confidence: 99%

Structural and mechanical characterisation of the chromium nitride hard coating deposited on the silicon and glass substrate

Shah¹

2017

Int. J. Automot. Mech. Eng.

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Chromium Nitride (CrN) thin films are known for their comparatively good mechanical properties. CrN was deposited on Silicon (100) and glass substrates by using DC magnetron sputtering and the influence of the partial nitrogen content and different gaseous environment on their microstructural characteristics were investigated in the present work. The CrN films were characterised with X-Ray Diffraction (XRD), Field Emission Scanning Electron Microscopy (FE-SEM), Atomic Force Microscopy (AFM) and Nanoindentation was used to characterise the structural and mechanical properties of the deposited thin film. The films showed the [200] preferred orientation at lower (at 20%) nitrogen contents while the intensity of the peak [111] increases with the increase in the nitrogen content. The Cr2N (220) peak was identified at a nitrogen content above 30%, but for nitrogen content above 40%, the CrN phase was observed in both films deposited on Si(100) and glass substrates. The preferred orientations of the CrN thin films are strongly influenced by the nitrogen content inside the chamber as observed in the present work. The surface roughness and deposition rate were observed in a reducing trend with the increasing N2 content and temperature from 20.31 to 2.71nm and from 30.16 nm/min to 25.66nm/min, respectively. The hardness and modulus of pure N2 films deposited on the Si substrates were evaluated by nanoindentaion testing and indicated 31 GPa and 250 GPa, respectively.

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Section: Introductionmentioning

confidence: 99%

Structural and mechanical characterisation of the chromium nitride hard coating deposited on the silicon and glass substrate

Shah¹

2017

Int. J. Automot. Mech. Eng.

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“…3 Development of the structure in the~1,000 nm thick transparent TiO 2 films reactively sputtered on unheated glass substrates at I da1,2 = 3 A, d s-t = 100 mm and T surf % 160-180°C, p T = 0.9 Pa and p O2 = 0.15 Pa with increasing f r film together with desired oxygen partial pressure p O2 . In this case the total flow rate of sputtering gas mixture / T = / Ar + / O2 exceeds a critical value given by the pumping speed of the system, which results in a slower system response leading to instabilities in a closed control circuit [26,27]. The closed control loop is discussed in detail in Ref.…”

Section: Effect Of Oxygen Partial Pressure P O2mentioning

confidence: 99%

High-rate low-temperature dc pulsed magnetron sputtering of photocatalytic TiO2films: the effect of repetition frequency

et al. 2007

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The article reports on low-temperature high-rate sputtering of hydrophilic transparent TiO 2 thin films using dc dual magnetron (DM) sputtering in Ar + O 2 mixture on unheated glass substrates. The DM was operated in a bipolar asymmetric mode and was equipped with Ti(99.5) targets of 50 mm in diameter. The substrate surface temperature T surf measured by a thermostrip was less than 180°C for all experiments. The effect of the repetition frequency f r was investigated in detail. It was found that the increase of f r from 100 to 350 kHz leads to (a) an improvement of the efficiency of the deposition process that results in a significant increase of the deposition rate a D of sputtered TiO 2 films and (b) a decrease of peak pulse voltage and sustaining of the magnetron discharge at higher target power densities. It was demonstrated that several hundreds nm thick hydrophilic TiO 2 films can be sputtered on unheated glass substrates at a D = 80 nm/min, T surf < 180°C when high value of f r = 350 kHz was used. Properties of a thin hydrophilic TiO 2 film deposited on a polycarbonate substrate are given.

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“…Aluminum nitride has a variety of excellent physical properties, such as a high melting point (3273 K), high thermal conductivity (285 W/mK), high direct band gap (6.2 Ev), good dielectric constant (8.5) and high hardness (about ~ 2×103 kgf mm-2) [13,14,15]. Common ways of depositing aluminum nitride films include DC and RF magnetron sputtering [13][14][15][16][17][18], chemical vapor deposition [19,20], and molecular beam epitaxy [21]. However, the CVD and MBE methods can only be used at high temperatures, and this limits the base materials that can be used, and if the resulting grains are too big then this will lead to a rough surface, and so it will not be possible to easily manufacture electrodes on the films.…”

Section: Introductionmentioning

confidence: 99%

High-quality AlN films grown on chemical vapor-deposited graphene films

Chen

Hsiu-Hao

David

2016

MATEC Web of Conferences

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Abstract.We report the growth of high-quality AlN films on graphene. The graphene films were synthesized by CVD and then transferred onto silicon substrates. Epitaxial aluminum nitride films were deposited by DC magnetron sputtering on both graphene as an intermediate layer and silicon as a substrate. The structural characteristics of the AlN films and graphene were investigated. Highly c-axis-oriented AlN crystal structures are investigated based on the XRDpatterns observations.

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Recent aspects concerning DC reactive magnetron sputtering of thin films: a review

Cited by 459 publications

References 64 publications

Structural and mechanical characterisation of the chromium nitride hard coating deposited on the silicon and glass substrate

Structural and mechanical characterisation of the chromium nitride hard coating deposited on the silicon and glass substrate

High-rate low-temperature dc pulsed magnetron sputtering of photocatalytic TiO2films: the effect of repetition frequency

High-quality AlN films grown on chemical vapor-deposited graphene films

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