2011
DOI: 10.1016/j.proeng.2011.11.103
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Recent Assessment of Surface Integrity Resulting from Fine Finishing Processes

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Cited by 5 publications
(2 citation statements)
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“…According to the measured vertical retreats and corresponding surface topography, it is evident that the adopted polishing method affected the crystal structure and its reactivity to a depth of several micrometers below the surface, which is consistent with studies of near surface damage generated by mechanical polishing of various crystalline materials (Lucca et al, 2006;Klopfstein and Lucca, 2011). This fact implies that, if the same conditions are maintained, the observed surface topography and the increased retreat rates represent transient non-steady state conditions towards a smoother topography and slower rates of dissolution, which will be attained after the extent of surface retreat becomes larger than the thickness of the crystal affected by damage due to sample treatment.…”
Section: Influence Of Mechanical Polishing On Surface Topography and Measured Retreat Ratessupporting
confidence: 83%
“…According to the measured vertical retreats and corresponding surface topography, it is evident that the adopted polishing method affected the crystal structure and its reactivity to a depth of several micrometers below the surface, which is consistent with studies of near surface damage generated by mechanical polishing of various crystalline materials (Lucca et al, 2006;Klopfstein and Lucca, 2011). This fact implies that, if the same conditions are maintained, the observed surface topography and the increased retreat rates represent transient non-steady state conditions towards a smoother topography and slower rates of dissolution, which will be attained after the extent of surface retreat becomes larger than the thickness of the crystal affected by damage due to sample treatment.…”
Section: Influence Of Mechanical Polishing On Surface Topography and Measured Retreat Ratessupporting
confidence: 83%
“…Tensile testing and X-ray diffraction are also options to measure tensile strength and ductility and residual stresses of machined components as well. The first technique is a destructive method while the second one is generally limited to a spatial resolution of about 1 μm and by high cost of the instrumentation equipment [7]. So, techniques that combine non-destructive characteristics, rapidness, and low cost to monitor and to prevent thermal damages in engineered parts are always pursued.…”
Section: Introductionmentioning
confidence: 99%