Recent developments in advanced polymeric materials for solder mask application: Progress and challenges

Lim, William Yung Ling; Jaafar, Mariatti; Ishak, Ku Marsilla Ku; Chinniah, Karuna; Chan, Wooi Keong

doi:10.1016/j.jsamd.2023.100567

Journal of Science: Advanced Materials and Devices

2023

DOI: 10.1016/j.jsamd.2023.100567

|View full text |Cite

Recent developments in advanced polymeric materials for solder mask application: Progress and challenges

William Yung Ling Lim

Mariatti Jaafar

Ku Marsilla Ku Ishak

et al.

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...

Citation Types

Supporting

Mentioning

Contrasting

Year Published

2024

Publication Types

Select...

Article3

Relationship

Self Cite0

Independent3

Authors

Journals

Cited by 3 publications

(1 citation statement)

References 104 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…65,69 Conventionally, hot air solder level (HASL) was used to submerge the boards in a tin/lead mix, followed by the removal of excess soldering material with hot air prior to baking. 70 However, the toxicity of lead and uneven coatings of HASL has raised concerns with this method.…”

mentioning

confidence: 99%

Editors’ Choice—Challenges and Opportunities for Developing Electrochemical Biosensors with Commercialization Potential in the Point-of-Care Diagnostics Market

Akhlaghi,

Kaur,

Adhikari

et al. 2024

ECS Sens. Plus

View full text Add to dashboard Cite

There is a plethora of electrochemical biosensors developed for ultrasensitive detection of clinically-relevant biomarkers. However, many of these systems lose their performance in heterogeneous clinical samples and are too complex to be operated by end users at the point-of-care (POC), prohibiting their commercial success. Integration of biosensors with sample processing technology addresses both of these challenges; however, it adds to the manufacturing complexity and the overall cost of these systems. Herein, we review the different components of a biosensor and avenues for creating fully-integrated systems. In the context of integration, we focus on discussing the trade-offs between sensing performance, cost, and scalable manufacturing to guide the readers toward designing new electrochemical biosensors with commercialization potential.

show abstract

mentioning

confidence: 99%

Editors’ Choice—Challenges and Opportunities for Developing Electrochemical Biosensors with Commercialization Potential in the Point-of-Care Diagnostics Market

Akhlaghi,

Kaur,

Adhikari

et al. 2024

ECS Sens. Plus

View full text Add to dashboard Cite

show abstract

High-Adhesion Epoxy-Based Solder Resist Dry Film for Integrated Circuits Enhanced by 2,2-Bis(hydroxymethyl)propionic Acid

Zhang,

Wang,

et al. 2024

ACS Appl. Polym. Mater.

View full text Add to dashboard Cite

The increasing demand for high performance and miniaturization of electronic devices creates an urgent need for solder resist materials with excellent comprehensive properties. We report a photothermal dual-curable solder resist dry film (SRF) material. The preparation method and performance characteristics of epoxy-based SRF modified with acrylic acid, 2,2-bis-(hydroxymethyl)propionic acid (DMPA), and cis-1,2,3,6-tetrahydrophthalic anhydride were systematically studied and also compared with the commercially available product. With the introduction of DMPA, SRF-2 exhibits excellent adhesion, and the peel strength between SRF-2 and copper increased from 0.33 to 0.45 N/mm, a 36% increase; this improvement was achieved by introducing a certain proportion of hydroxyl groups into the epoxy resin molecular chain. Additionally, its dielectric constant decreased from 3.73 to 3.38 and the room-temperature modulus increased from 5.1 to 5.4 GPa. Moreover, SRF-2 exhibits excellent thermal stability, hydrophobicity, and photolithographic performance, indicating potential application prospects in integrated circuits.

show abstract

Influence of Solder Mask on Electrochemical Migration on Printed Circuit Boards

Klimtová,

Veselý,

Králová

et al. 2024

Materials

View full text Add to dashboard Cite

Electrochemical migration (ECM) on the surface of printed circuit boards (PCBs) continues to pose a significant reliability risk in electronics. Nevertheless, the existing literature lacks studies that address the solder mask and solder pad design aspects in the context of ECM. Therefore, the objective of this study was to assess the impact of solder mask type with varying roughness and solder pad design on the susceptibility to ECM using a water drop test and thermal humidity bias test. Hot air solder leveling-coated PCBs were tested. Furthermore, the ECM tests were conducted on PCBs with applied no-clean solder paste to evaluate the influence of flux residues on the resulting ECM behavior. The results indicated that the higher roughness of the solder mask significantly contributes to ECM inhibition through the creation of a mechanical barrier for the dendrites. Furthermore, lower ECM susceptibility was also observed for copper-defined pads, where a similar effect is presumed. However, the influence of the no-clean flux residues can prevail over the effects of the solder mask. Therefore, the use of a rough solder mask and a copper-defined pad design is recommended if the PCB is to be washed from flux residues after the soldering process.

show abstract

scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.

Contact Info

customersupport@researchsolutions.com

10624 S. Eastern Ave., Ste. A-614

Henderson, NV 89052, USA

This site is protected by reCAPTCHA and the Google Privacy Policy and Terms of Service apply.

Blog Terms and Conditions API Terms Privacy Policy Contact Cookie Preferences Do Not Sell or Share My Personal Information

Made with 💙 for researchers

Part of the Research Solutions Family.

Recent developments in advanced polymeric materials for solder mask application: Progress and challenges

Cited by 3 publications

References 104 publications

Editors’ Choice—Challenges and Opportunities for Developing Electrochemical Biosensors with Commercialization Potential in the Point-of-Care Diagnostics Market

Editors’ Choice—Challenges and Opportunities for Developing Electrochemical Biosensors with Commercialization Potential in the Point-of-Care Diagnostics Market

High-Adhesion Epoxy-Based Solder Resist Dry Film for Integrated Circuits Enhanced by 2,2-Bis(hydroxymethyl)propionic Acid

Influence of Solder Mask on Electrochemical Migration on Printed Circuit Boards

Contact Info

Product

Resources

About