Recent Developments in Multi-Wire Fixed Abrasive Slicing Technique (Fast)

Schmid, F.; Khattak, C. P.; Smith, M. B.; Lynch, Liam

doi:10.1007/978-94-009-7898-0_161

Cited by 6 publications

(2 citation statements)

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“…FAST was introduced to sapphire slicing by Crystal Systems, Inc. (Salem, Massachusetts, USA) in 1999 [23,[29][30][31][32][33]. Figure 6 illustrates the FAST process.…”

Section: Fixed Abrasive Slicing Technology (Fast)mentioning

confidence: 99%

Machining processes for sapphire wafers: a literature review

Pei

Funkenbusch

2011

Proceedings of the Institution of Mechanical Engineers, Part B:

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Sapphire wafers are widely used as the substrates for fabricating GaN light-emitting diodes (LEDs). The quality of LEDs depends directly on the quality of the sapphire wafers. A series of machining processes is required to turn sapphire barstock into wafers with the desired geometry and surface quality. This paper reviews the literature on various machining processes for sapphire wafers: slicing (including outer diameter cut-off grinding, inner diameter cut-off grinding, loose abrasive multi-wire sawing, fixed abrasive slicing, and fixed abrasive multi-wire sawing), flattening (including lapping and grinding), and surface finishing (including mechanical polishing and chemical mechanical polishing). New machining technologies are also introduced.

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“…FAST was introduced to sapphire slicing by Crystal Systems, Inc. (Salem, Massachusetts, USA) in 1999 [23,[29][30][31][32][33]. Figure 6 illustrates the FAST process.…”

Section: Fixed Abrasive Slicing Technology (Fast)mentioning

confidence: 99%

Machining processes for sapphire wafers: a literature review

Pei

Funkenbusch

2011

Proceedings of the Institution of Mechanical Engineers, Part B:

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“…His research showed that the saw force directly affect the surface quality of the wafers, the downbound feed speed did not affect the surface quality but could affect the thickness of the damaged layer on the wafer's surface, and the swing saw was good at improving the surface quality. Schmid also thought the swing saw can reduce the contact area between the saw and the silicon, and increase the pressure between tip of the diamond particle and silicon, finally improving the efficiency [16]. Ge P Q and Gao Wei had developed the single wire saw machines independently and researched the technological parameter [17][18].…”

Section: Slicing Technologymentioning

confidence: 99%