Recent fluid–structure interaction modeling challenges in IC encapsulation – A review

Khor, C. Y.; Abdullah, M. Z.; Azid, Ishak Abdul

doi:10.1016/j.microrel.2014.03.012

Cited by 18 publications

(10 citation statements)

References 64 publications

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“…Current, most of the analysis relating to encapsulation process are conducted using FVM based software. Though FVM provide an accurate and reliable simulation in comparison to experimental findings [ 36 ] detection of micro-defect, i.e. void formation is still relatively difficult to be visualized during the encapsulation process.…”

Section: Resultsmentioning

confidence: 99%

Lattice Boltzmann Method of Different BGA Orientations on I-Type Dispensing Method

et al. 2016

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This paper studies the three dimensional (3D) simulation of fluid flows through the ball grid array (BGA) to replicate the real underfill encapsulation process. The effect of different solder bump arrangements of BGA on the flow front, pressure and velocity of the fluid is investigated. The flow front, pressure and velocity for different time intervals are determined and analyzed for potential problems relating to solder bump damage. The simulation results from Lattice Boltzmann Method (LBM) code will be validated with experimental findings as well as the conventional Finite Volume Method (FVM) code to ensure highly accurate simulation setup. Based on the findings, good agreement can be seen between LBM and FVM simulations as well as the experimental observations. It was shown that only LBM is capable of capturing the micro-voids formation. This study also shows an increasing trend in fluid filling time for BGA with perimeter, middle empty and full orientations. The perimeter orientation has a higher pressure fluid at the middle region of BGA surface compared to middle empty and full orientation. This research would shed new light for a highly accurate simulation of encapsulation process using LBM and help to further increase the reliability of the package produced.

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Section: Resultsmentioning

confidence: 99%

Lattice Boltzmann Method of Different BGA Orientations on I-Type Dispensing Method

et al. 2016

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“…In this study, the Kamal-Malkin model is used to model curing kinetics, since it is a well-known and often used model for curing kinetics of thermoset polymers [11,[16][17][18][19][20][21]. The model describes the cure rate by…”

Section: Model For Curing Kineticsmentioning

confidence: 99%

“…The Castro-Macosko viscosity model [6] is an often used and well-established model to simulate the viscosity of thermoset materials [11,20,21]. The model describes the viscosity as a function of temperature T, shear rate .…”

Section: Model For Viscositymentioning

confidence: 99%

Simulation of Reinforced Reactive Injection Molding with the Finite Volume Method

et al. 2018

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Abstract:The reactive process of reinforced thermoset injection molding significantly influences the mechanical properties of the final composite structure. Therefore, reliable process simulation is crucial to predict the process behavior and relevant process effects. Virtual process design is thus highly important for the composite manufacturing industry for creating high quality parts. Although thermoset injection molding shows a more complex flow behavior, state of the art molding simulation software typically focusses on thermoplastic injection molding. To overcome this gap in virtual process prediction, the present work proposes a finite volume (FV) based simulation method, which models the multiphase flow with phase-dependent boundary conditions. Compared to state-of-the-art Finite-Element-based approaches, Finite-Volume-Method (FVM) provides more adequate multiphase flow modeling by calculating the flow at the cell surfaces with an Eulerian approach. The new method also enables the description of a flow region with partial wall contact. Furthermore, fiber orientation, curing and viscosity models are used to simulate the reinforced reactive injection molding process. The open source Computational-Fluid-Dynamics (CFD) toolbox OpenFOAM is used for implementation. The solver is validated with experimental pressure data recorded during mold filling. Additionally, the simulation results are compared to commercial Finite-Element-Method software. The simulation results of the new FV-based CFD method fit well with the experimental data, showing that FVM has a high potential for modeling reinforced reactive injection molding.

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“…Therefore, computer-aided software is advantageous to provide clear visualization on these aspects. The accuracy of the thermal characteristics depends on the input (Khor et al , 2014) of the oven’s thermal profile in the setting of virtual modelling. The example of setting is the data of the temperature profile that keys into the virtual modelling software; it should be exactly similar with the experimental setup.…”

Section: Challenges In Modelling the Reflow Soldering Processmentioning

confidence: 99%

Thermo-mechanical challenges of reflowed lead-free solder joints in surface mount components: a review

Lau¹,

Khor

Soares

et al. 2016

SSMT

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Purpose The purpose of the present study was to review the thermo-mechanical challenges of reflowed lead-free solder joints in surface mount components (SMCs). The topics of the review include challenges in modelling of the reflow soldering process, optimization and the future challenges in the reflow soldering process. Besides, the numerical approach of lead-free solder reliability is also discussed. Design/methodology/approach Lead-free reflow soldering is one of the most significant processes in the development of surface mount technology, especially toward the miniaturization of the advanced SMCs package. The challenges lead to more complex thermal responses when the PCB assembly passes through the reflow oven. The virtual modelling tools facilitate the modelling and simulation of the lead-free reflow process, which provide more data and clear visualization on the particular process. Findings With the growing trend of computer power and software capability, the multidisciplinary simulation, such as the temperature and thermal stress of lead-free SMCs, under the influenced of a specific process atmosphere can be provided. A simulation modelling technique for the thermal response and flow field prediction of a reflow process is cost-effective and has greatly helped the engineer to eliminate guesswork. Besides, simulated-based optimization methods of the reflow process have gained popularity because of them being economical and have reduced time-consumption, and these provide more information compared to the experimental hardware. The advantages and disadvantages of the simulation modelling in the reflow soldering process are also briefly discussed. Practical implications This literature review provides the engineers and researchers with a profound understanding of the thermo-mechanical challenges of reflowed lead-free solder joints in SMCs and the challenges of simulation modelling in the reflow process. Originality/value The unique challenges in solder joint reliability, and direction of future research in reflow process were identified to clarify the solutions to solve lead-free reliability issues in the electronics manufacturing industry.

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Recent fluid–structure interaction modeling challenges in IC encapsulation – A review

Cited by 18 publications

References 64 publications

Lattice Boltzmann Method of Different BGA Orientations on I-Type Dispensing Method

Lattice Boltzmann Method of Different BGA Orientations on I-Type Dispensing Method

Simulation of Reinforced Reactive Injection Molding with the Finite Volume Method

Thermo-mechanical challenges of reflowed lead-free solder joints in surface mount components: a review

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