2023
DOI: 10.3389/fbioe.2023.1178995
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Recent progress in fiber-based soft electronics enabled by liquid metal

Abstract: Soft electronics can seamlessly integrate with the human skin which will greatly improve the quality of life in the fields of healthcare monitoring, disease treatment, virtual reality, and human-machine interfaces. Currently, the stretchability of most soft electronics is achieved by incorporating stretchable conductors with elastic substrates. Among stretchable conductors, liquid metals stand out for their metal-grade conductivity, liquid-grade deformability, and relatively low cost. However, the elastic subs… Show more

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Cited by 2 publications
(1 citation statement)
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“…In [ 145 ], an Ag-In-Ga-poly(styrene-isoprene-styrene (SIS)) ink composite with added styrene–isoprene block copolymer enabled better mechanical integrity and adhesion on many substrates such as rubber and textile materials. Styrene block copolymers (i.e., SIS and poly(styrene-butadiene-styrene) (SBS)) have been integrated into conductive inks and exhibit great elasticity, conductivity, and adhesive properties, making them interesting additive candidates to be paired with liquid metal [ 146 ]. However, many of these styrene resins have a potentially hazardous effect on the skin (see Section 4.6 ), requiring further analysis.…”
Section: Considerations When Combining Substrates and Conductor Mater...mentioning
confidence: 99%
“…In [ 145 ], an Ag-In-Ga-poly(styrene-isoprene-styrene (SIS)) ink composite with added styrene–isoprene block copolymer enabled better mechanical integrity and adhesion on many substrates such as rubber and textile materials. Styrene block copolymers (i.e., SIS and poly(styrene-butadiene-styrene) (SBS)) have been integrated into conductive inks and exhibit great elasticity, conductivity, and adhesive properties, making them interesting additive candidates to be paired with liquid metal [ 146 ]. However, many of these styrene resins have a potentially hazardous effect on the skin (see Section 4.6 ), requiring further analysis.…”
Section: Considerations When Combining Substrates and Conductor Mater...mentioning
confidence: 99%