Recent Progress in the Development of Large-Capacity Integrated Silicon Photonics Transceivers

Abstract

We report our recent progress in silicon photonics integrated device technology targeting on-chip-level large-capacity optical interconnect applications. To realize high-capacity data transmission, we successfully developed on-package-type silicon photonics integrated transceivers and demonstrated simultaneous 400 Gbps operation. 56 Gbps pulse-amplitude-modulation (PAM) 4 and wavelength-divisionmultiplexing technologies were also introduced to enhance the transmission capacity.

Crosstalk reduction of integrated optical waveguides with nonuniform subwavelength silicon strips

“…Along with its further development, more and more waveguide elements need to be integrated on the silicon-on-insulator (SOI) platform 3 . Though various optical elements have been studied so far, such as transceivers, couplers/inverse taper, subwavelength gratings, multiplexers and so on [4][5][6][7][8][9] , the packing density of photonic integrated circuits (PICs) is still not as high as their electronic counterparts 10 . The reason is that the diffraction limit hinders the further shrinking of waveguide 11 .…”