“…[12,13] Given the limited carrier mobility and the coarse resolution of printing tools, printed organic electronics has struggled to deliver the challenging performances required to enable wireless capabilities. [21,22] However such high performances are either achieved by resorting to conventional micro and nanofabrication techniques (i.e., e-beam lithography, chemical vapor deposition, sputtering, and thermal evaporation), or pose scaling and processing issues (placing of high-quality monolayers of 2D materials, [23] alignment of carbon nanotubes, [24][25][26][27] and process temperatures compatible with cheap plastic substrates for high-quality metal-oxide layers [28,29] ).It is therefore highly desirable to further develop printed and flexible organic electronics in order to achieve high-frequency operation. [21,22] However such high performances are either achieved by resorting to conventional micro and nanofabrication techniques (i.e., e-beam lithography, chemical vapor deposition, sputtering, and thermal evaporation), or pose scaling and processing issues (placing of high-quality monolayers of 2D materials, [23] alignment of carbon nanotubes, [24][25][26][27] and process temperatures compatible with cheap plastic substrates for high-quality metal-oxide layers [28,29] ).…”