Recent Progress in Transient Liquid Phase and Wire Bonding Technologies for Power Electronics

Abstract

Transient liquid phase (TLP) bonding is a novel bonding process for the joining of metallic and ceramic materials using an interlayer. TLP bonding is particularly crucial for the joining of the semiconductor chips with expensive die-attached materials during low-temperature sintering. Moreover, the transient TLP bonding occurs at a lower temperature, is cost-effective, and causes less joint porosity. Wire bonding is also a common process to interconnect between the power module package to direct bonded copper (DBC). In this context, we propose to review the challenges and advances in TLP and ultrasonic wire bonding technology using Sn-based solders for power electronics packaging.

Emerging Interconnection Technology and Pb-Free Solder Materials for Advanced Microelectronic Packaging

“…In another article, Kang et al [4] present a comprehensive review of TLP and wire bonding technologies for high-temperature power electronics devices. The authors overviewed various bonding mechanisms, including solid-state diffusion bonding, TLP bonding, and dissimilar materials brazing for power modules.…”

Anand constitutive modeling of multilayer Silver-Tin transient liquid phase foils using tensile and creep testing

“…Generally, the AgSn-TLP joints offer high-temperature stability and improved shear strengths that is up to 50–60 MPa (Shao et al , 2017), which are substantially higher than the values of Sn-based solders (Siewert et al , 2002; Kang et al , 2020) and comparable to sintered silver die bonds (Esa et al , 2021; Heilmann et al , 2023; Strahringer and Wilde, 2023).…”

A study on the thermomechanical response of various die attach metallic materials of power electronics

“…One common TLP configuration is silver-tin (AgSn), in which a thin layer of Sn is surrounded by two silver partner layers. During the TLP processing, the system is heated up to a temperature above the melting point of the tin, allowing for the diffusion process to begin, resulting in stable AgSn TLP bonds (Sun et al , 2020; Kang et al , 2020). Such interconnects contain two IMC phases, namely, Ag 3 Sn and Ag 5 Sn phases (Lis and Leinenbach, 2015; Mokhtari, 2019; Moeini et al , 2014; Feißt et al , 2019).…”