Gallium Nitride Materials and Devices XV 2020
DOI: 10.1117/12.2540737
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Recent progress of large size and low dislocation bulk GaN growth

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Cited by 20 publications
(23 citation statements)
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“…In the case of GaN, the (0001) surface (c-plane) is mainly considered. Today, the lowest value of TDD, of the order of 10 4 cm −2 , is reported for Am-GaN [21][22][23]. This value is two orders of magnitude lower than TDD in commercially available HVPE-GaN wafers.…”
Section: Requirements For Gan Substratesmentioning
confidence: 92%
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“…In the case of GaN, the (0001) surface (c-plane) is mainly considered. Today, the lowest value of TDD, of the order of 10 4 cm −2 , is reported for Am-GaN [21][22][23]. This value is two orders of magnitude lower than TDD in commercially available HVPE-GaN wafers.…”
Section: Requirements For Gan Substratesmentioning
confidence: 92%
“…To this day, the formation of side facets has not been defeated and they are still created during HVPE-GaN growth in the [0001] direction. In spite of this, MCC has already demonstrated 4mm-thick HVPE-GaN-on-Am-GaN [22] and IHPP PAS showed 3-mm-thick HVPE-GaN-on-Am-GaN (see Figure 9b) [55]. It was observed that during the homoepitaxial crystallization of HVPE-GaN in the [0001] direction the non-polar and semi-polar growth of "wings" (laterally-grown material) leads to the formation of large stress close to the edges of the growing crystal.…”
Section: Hvpe-gan On Native Ammonothermal Gan Seedsmentioning
confidence: 99%
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“…The experimental geometry of ammonothermal setups for bulk growth of GaN is generally some variation of the setup depicted in Figure 3a, which is based on several articles from the literature [4,20,44,45] and the experience of the authors. The internal configuration shown in the figure is valid for the case of retrograde solubility of GaN.…”
Section: Simulation Domain and Geometrymentioning
confidence: 99%
“…Due to its scalability, the ammonothermal method is still believed to have the potential to become a strong competitor for halide vapor phase epitaxy (HVPE), which is the most common method for bulk GaN growth at present [13]. Recent progress in ammonothermal GaN growth includes a demonstration of scalability to pilot production for simultaneous growth of likely about 100 boules in one reactor [6], a masking technique for circumventing issues related to growth on different facets [18], growth of nearly bowfree crystals (radius of curvature: 1460 m) at pressures as low as 100 to 120 MPa [19], and growth of nearly 4-inch size crystals while keeping off-angle distributions as small as ±0.006 • along both a-axis and m-axis [20]. Besides its use for the growth of bulk GaN, the ammonothermal technique is increasingly being utilized for exploratory syntheses of various binary, ternary, and multinary nitride and oxynitride materials [21][22][23], including nitride semiconductors composed of earth-abundant elements [24].…”
Section: Introductionmentioning
confidence: 99%