Recent Progress of Photosensitive Polyimides

Abstract

Photosensitive polyimides (PSPIs) have been attracting great attention as insulating materials in microelectronic industry, and can be directly patterned to simplify processing steps. This article reviews recent works on development of PSPIs. After brief introduction, a typical PSPI formulation was described in comparison with a conventional method, followed by major strategies for the patterning. A number of recent reports on PSPIs were then divided into two major terms; positive-working and negative-working, and highlighted with focus on their chemistries up to pattern formation. In addition to the photosensitivity of PSPIs picked up in this review, other important subjects such as low-temperature imidization and low dielectric constants were also discussed.

Development of Photosensitive Vinyl Polymers with Imide Group Based on Reaction Development Patterning

“…The photosensitive polymers for electronics packaging such as buffer coats and interlayer dielectrics require high thermal, mechanical and insulating properties on account of permanent utilization of the obtained patterns, while their required resolution is usually of the order of micrometers. For such the applications, addition of photosensitivity to polyimides, known as one of the representative high performance engineering plastics, has been investigated [3]. Existing methods for preparing photosensitive polyimides are utilization of poly(amic acid)s as polyimide precursors and functionalized polyimides as polymer components [4][5][6][7].…”

Polymer composite based microbolometers

“…imides are very stable against most solvents and high temperature strains (> 300 • C) (Fukukawa and Ueda, 2008) and therefore suitable for use as permanent, structuring carrier layers, which are created in the first process step of the microbolometer array manufacture.…”

Development of Photosensitive Alicyclic Polyimides Based on Reaction Development Patterning

“…In use of photosensitive polymers for electronics packaging such as buffer coats and interlayer dielectrics, they remain in manufactures permanently, and therefore, they are required to have high thermal, mechanical and insulating properties. For such the applications, addition of photosensitivity to polyimides, known as representative high performance engineering plastics, has been investigated [3]. Most of existing methods for preparing photosensitive polyimides include utilization of poly(amic acid)s as polyimide precursors.…”