Incorporating emerging ultrawide bandgap semiconductors
with a
metal–semiconductor–metal (MSM) architecture is highly
desired for deep-ultraviolet (DUV) photodetection. However, synthesis-induced
defects in semiconductors complicate the rational design of MSM DUV
photodetectors due to their dual role as carrier donors and trap centers,
leading to a commonly observed trade-off between responsivity and
response time. Here, we demonstrate a simultaneous improvement of
these two parameters in ε-Ga2O3 MSM photodetectors
by establishing a low-defect diffusion barrier for directional carrier
transport. Specifically, using a micrometer thickness far exceeding
its effective light absorption depth, the ε-Ga2O3 MSM photodetector achieves over 18-fold enhancement of responsivity
and simultaneous reduction of the response time, which exhibits a
state-of-the-art photo-to-dark current ratio near 108,
a superior responsivity of >1300 A/W, an ultrahigh detectivity
of
>1016 Jones, and a decay time of 123 ms. Combined depth-profile
spectroscopic and microscopic analysis reveals the existence of a
broad defective region near the lattice-mismatched interface followed
by a more defect-free dark region, while the latter one serves as
a diffusion barrier to assist frontward carrier transport for substantially
enhancing the photodetector performance. This work reveals the critical
role of the semiconductor defect profile in tuning carrier transport
for fabricating high-performance MSM DUV photodetectors.