patches have been recommended by physicians for patients with heart abnormalities to correlate their activities with heart signals. [2] In order for long-duration on-skin monitoring, comfort to the wearer is an important design consideration for these patches. To enable intimate attachment to the body, the package modulus and form factor should approach that of the human skin. Besides enhancing comfort, good electrical contact for high fidelity signal acquisition that is immune to the motion of wearer and environment influences are necessary. [8] Despite significant advancement in wearable electronics, [1, major tradeoffs between form-factor, performance, and functionality remain. For ultrathin skin-like material systems fabricated by ink-printing or microcontact transfer printing, [9][10][11][12][13][14][15][20][21][22][25][26][27] the complexity and signal processing capabilities are typically limited by the weaker transistors or interconnects. Ink-printed components are also limited by lower integration density compared to rigid Silicon CMOS technologies, leading to lower functionality. The increased R-C parasitic with larger and weaker components limits the scalability toward highly-energy-efficiency under low-voltage operations. In contrast, rigid CMOS chips and printed circuit boards (PCBs) require integration with soft components to interface comfortably with the human body. The need for electrical performance with soft and robust mechanical form factor leads us to the codesign of composite materials and electronic circuits/system in a monolithic form of flexible hybrid electronics. [1,3,4,12,13,25,28] In this work, we report on a novel integration of a wearable and stretchable-hybrid SEP with monolithically integrated sensor electrodes and liquid-metal interconnects. The SEP integration involves the combination of a chip-on-board embedded in a moisture-resistant elastomer matrix with microfluidic interconnects, and soft low-resistance electrodes (Figure 1).
A stretchable electrocardiogram (ECG) patch (SEP) that monolithically integrates ECG monitoring chip-on-board (COB) with polydimethylsiloxane (PDMS) and liquid-metal interconnects is presented. The 4.8 Ă 4.8 cm 2 SEPis conformal and robust to mechanical deformation. The use of a siliconon-insulator rigid complementary-metal-oxide-semiconductor chip allows sophisticated power management and signal processing. The chip's dense inputs/output pads are interfaced with coarser liquid-metal interconnects using a dual-sided COB design. A robust ECG signal response (â100 mV p-p up to 1 kHz), subjected to mechanical deformation and moisture is demonstrated. The SEP allows up to 10% stretch, providing sufficient pliability to enable conformal contact to the human chest. Low profile soft carbon black-PDMS nanocomposite electrodes, robust to deformation, enable good skin contact and allow for low-noise signal acquisition that is comparable to larger commercial wet electrodes.