Recess in the motherboard architectures for small form factor systems

Swettlen, Tim; Landeros, Juan; Mokler, Scott; Caputo, Antonio Casimiro

doi:10.4071/2380-4505-2018.1.000013

Cited by 1 publication

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“…In particular, the integration of technologies required by the convergence industry has the following technical characteristics, making it more difficult to solve problems such as electromagnetic interference [ 1 , 7 , 8 ].…”

Section: Introductionmentioning

confidence: 99%

Transparent Electromagnetic Shielding Film Utilizing Imprinting-Based Micro Patterning Technology

et al. 2021

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Utilization of methods involving component integration has accelerated, owing to the growth of the smart mobile industry. However, this integration leads to interference issues between the components, thereby elucidating the importance of the electromagnetic interference (EMI) shielding technology to solve such issues. EMI shielding technology has been previously implemented via the reflection or absorption of electromagnetic waves by using conductive materials. Nevertheless, to tackle the recent changes in the industry, a transparent and flexible EMI shielding technology is necessitated. In this study, a transparent and flexible EMI shielding material was fabricated by filling a conductive binder in a film comprising an intaglio pattern; this was achieved by using the ultraviolet (UV) imprinting technology to realize mass production. Subsequently, changes in the aperture ratio and shielding characteristics were analyzed according to the structure of the pattern. Based on this analysis, a square pattern was designed and a film with an intaglio pattern was developed through a UV imprinting process. Furthermore, it was confirmed that the transmittance, conductivity, and EMI shielding rate of the film were altered while changing the coating thickness of the conductive particles in the intaglio pattern. The final film prepared in this study exhibited characteristics that satisfied the required EMI shielding performance for electric and electronic applications, while achieving flexible structural stability and transparency.

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Section: Introductionmentioning

confidence: 99%