2023
DOI: 10.3390/s23031381
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Reciprocating Arc Silicon Strain Gauges

Abstract: Currently, silicon-strain-gauge-based diaphragm pressure sensors use four single-gauge chips for high-output sensitivity. However, the four-single-gauge configuration increases the number of glass frit bonds and the number of aluminum wire bonds, reducing the long-term stability, reliability, and yield of the diaphragm pressure sensor. In this study, a new design of general-purpose silicon strain gauges was developed to improve the sensor output voltage while reducing the number of bonds. The new gauges consis… Show more

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Cited by 3 publications
(1 citation statement)
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“…The bonding of the glass frit for the newly developed half-bridge gauge does not differ from that used with conventional silicon strain gauges [7,26,27]. The bonding process was carried out in three main steps: screen printing of the glass paste, its thermal conditioning and actual bonding [26][27][28]. Thermal conditioning transforms the glass paste into a glass layer.…”
Section: Gauge Chips and Diaphragm Assemblymentioning
confidence: 99%
“…The bonding of the glass frit for the newly developed half-bridge gauge does not differ from that used with conventional silicon strain gauges [7,26,27]. The bonding process was carried out in three main steps: screen printing of the glass paste, its thermal conditioning and actual bonding [26][27][28]. Thermal conditioning transforms the glass paste into a glass layer.…”
Section: Gauge Chips and Diaphragm Assemblymentioning
confidence: 99%