Recovery of silicon kerf waste from diamond wire sawing by two-step sintering and acid leaching method

Zhang, Yaohao; Wang, Sheng; Huang, Liuqing; Zhang, Chentong; Tang, Xin; Luo, Xuetao

doi:10.1016/j.jclepro.2020.121911

Cited by 37 publications

(14 citation statements)

References 40 publications

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“…Grain boundary curvature ( r ) provides the driving force for coalescence and can be given as where θ is the dihedral angle of the two grains, and G 1 and G 2 are the grain sizes of DWSSP ( G 1 is larger than G 2 ). In addition, on the basis of our previous research, changes in structure are accompanied by changes in valence; metastable Si suboxides tended to decompose into SiO 2 and stable Si under argon atmosphere at 1400 °C. Meanwhile, part of the oxygen may be removed in the form of gaseous SiO, and oxygen-containing gas may reduce the relative density and fracture toughness of DWSSP ceramics …”

Section: Resultsmentioning

confidence: 86%

“…However, about 40% of crystalline silicon is still wasted in the form of diamond wire saw silicon powder (DWSSP). − It mainly contains high-purity crystalline silicon and other impurities that were generated during the slicing process . Besides, an amorphous silica (SiO x ) shell is wrapped around it.…”

Section: Introductionmentioning

confidence: 99%

“…10−12 It mainly contains high-purity crystalline silicon and other impurities that were generated during the slicing process. 13 Besides, an amorphous silica (SiO x ) shell is wrapped around it. This powder is an environmentally hazardous waste if it is released on agricultural lands or in contact with water.…”

Section: ■ Introductionmentioning

confidence: 99%

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Application of Pressure-less Sintering and Dynamic-Slag Treatment to Recover Diamond Wire Saw Silicon Powder

Chen

Wang

Huang

et al. 2020

ACS Sustainable Chem. Eng.

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Recycling silicon from environmentally hazardous diamond wire saw silicon powder waste (DWSSP) and effectively removing boron is still an elusive aim. Here, pressure-less sintering and dynamic-slag treatment were used to recover the powder waste. On the basis of thermodynamic simulation, the slag composition was designed. Dense structure of DWSSP ceramics could effectively reduce the oxidation loss. Dynamic-slag treatment can provide higher silicon recovery and better boron removal rate than can traditional one-step slag treatment. Slag-1 (Na 2 O-SiO 2 ) can remove boron while protecting molten silicon from oxidation. Interestingly, after Slag-2 (CaO−SiO 2 −Na 2 O) was added, relative displacement between the mixed slag and silicon can provide more favorable dynamic conditions. Using the dynamic-slag treatment, the boron removal efficiency reached 83.4%, and the silicon recovery rate reached 82.29%. Additionally, by introducing the solute penetration theory, the mechanism of boron removal during convective mass transfer process was discussed in detail. The simplicity of this combined approach provides a new possibility for recovery and purification of intractable fine powdery waste.

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Section: Resultsmentioning

confidence: 86%

Section: Introductionmentioning

confidence: 99%

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Application of Pressure-less Sintering and Dynamic-Slag Treatment to Recover Diamond Wire Saw Silicon Powder

Chen

Wang

Huang

et al. 2020

ACS Sustainable Chem. Eng.

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“…Furthermore, no records were found regarding the dielectric properties of silicon particles filled epoxy matrix. Kerf loss from a diamond wire sawing operation Two step sintering method Acid based leaching process [17] The aim of the proposed work is to reuse the recovered silicon particle as a filler in a glass fiber reinforced epoxy polymer composite. The microstructure and the crystallographic structure of the recovered silicon particle was studied using Scanning Electron Microscopy (SEM) and X-Ray diffraction technique.…”

Section: Introductionmentioning

confidence: 99%

A Novel Approach on Reusing Silicon Wafer Kerf Particle as Potential Filler Material in Polymer Composite

Nambiraj

Rajkumar

Sabarinathan

2021

Silicon

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In solar panel production stage, it is unavoidable to neglect the huge amount of solar grade silicon particles displaced during the slicing of silicon ingot operation. A subject of the present study is to reuse the solar-grade silicon particles as a filler to enhance the mechanical properties of the epoxy-glass fiber polymer composite. Polymer composite was fabricated using a hand-layup method with constant hydraulic pressure by varying filler weight percentages of 0, 1, 3, 5, and 10 %. Particle size and mineralogical features of the recovered silicon particle were characterized by particle size analyser and X-ray diffraction analysis. A positive effect on the mechanical properties of the prepared composites is seen by the recovered silicon particle addition. Maximum tensile strength of 284 MPa has been achieved for the < 10 µm particle with a 5 % weight of silicon filler loaded composite. Both the flexural strength and the hardness of the composites were improved linearly by the addition of the filler material. The dielectric constant is considerably improved by incorporating recovered silicon filler into the epoxy polymer composite. There is a comparatively higher dielectric constant value of 5.96 in a fine silicon particle-filled composite than in a coarse silicon particle-filled composite of 4.8. The sustainable use of silicon wafer cutting particles in polymer composites would mitigate the problems of pollution and minimise the cost of silicon wafer waste disposal as well. This brings up the solution to recycling of silicon wafer cutting waste for a sustainable environment.

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“…To recycle silicon derived from DWSSP, increasing the yield of high-purity silicon is an imperative issue that needs to be resolved . The metallurgical route has become a popular method for silicon purification due to its low cost and environmental friendliness associated with its sustainable process. , As leaching is the primary and essential stage for the recovery of metals in comparison with pyrometallurgical treatments, , the metallic impurities present in DWSSP could be removed with a cost-effective compatible acid leaching pretreatment process.…”

Section: Introductionmentioning

confidence: 99%

Occurrence State and Dissolution Mechanism of Metallic Impurities in Diamond Wire Saw Silicon Powder

Yang

Wan

Wei

et al. 2020

ACS Sustainable Chem. Eng.

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The facilitation of metallic impurities removal via acid leaching pretreatment plays a key role in silicon recovery from diamond wire saw silicon powder (DWSSP) waste. Disappointingly, the occurrence state and dissolution mechanism of the metallic impurities present in DWSSP have not yet been revealed. For this reason, in this study, three different kinds of raw DWSSP were used for acid leaching tests and leaching behavior verification to investigate the dissolution mechanism. After two-stage acid leaching with 4 M HCl and 2 M HCl + 2.5 M HF, the results indicate that the removal efficiency was superior to that of other previously reported leaching processes. Furthermore, two occurrence states of metallic impurities present in DWSSP were defined based on their different dissolution behaviors, and the intrinsic relationship between dissolution behavior and the thinning process of the amorphous SiO2 shell was derived. The findings indicate that the first type of impurity was more easily dissolved in HCl solution; however, the second type of retained metallic impurity was restricted by the SiO2 shell barrier and was removed by the added HF solution. For this reason, the disintegration dissolution of the amorphous SiO2 shell was found to have a significant impact on the facilitation of the removal of impurities retained in DWSSP. The findings of this study are significant for the recovery of silicon from DWSSP with an effective acid leaching flow design.

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Recovery of silicon kerf waste from diamond wire sawing by two-step sintering and acid leaching method

Cited by 37 publications

References 40 publications

Application of Pressure-less Sintering and Dynamic-Slag Treatment to Recover Diamond Wire Saw Silicon Powder

Application of Pressure-less Sintering and Dynamic-Slag Treatment to Recover Diamond Wire Saw Silicon Powder

A Novel Approach on Reusing Silicon Wafer Kerf Particle as Potential Filler Material in Polymer Composite

Occurrence State and Dissolution Mechanism of Metallic Impurities in Diamond Wire Saw Silicon Powder

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