Recycled low-temperature direct bonding of Si/glass and glass/glass chips for detachable micro/nanofluidic devices

Wang, Chenxi; Fang, Hui; Zhou, Shicheng; Qi, Xiaoyun; Niu, Fanfan; Zhang, Wei; Tian, Yanhong; Suga, Tadatomo

doi:10.1016/j.jmst.2019.11.034

Cited by 25 publications

(10 citation statements)

References 35 publications

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“…The results were evaluated to consider the mechanism involved in low-temperature glass bonding, which is not yet fully understood. Recently, Wang et al [ 28 ] experimentally investigated surface properties during bonding by contact angle measurement, atomic force microscopy, Raman scattering spectrometry and X-ray photoelectron spectroscopy, and proposed the following bonding mechanism. Upon activation by oxygen plasma, the oxygen free radicals break the covalent bonds of siloxane (Si-O-Si) on the glass surface and produce dangling Si-O- groups by the reaction, Si-O-Si + O* → Si- + Si-O-.…”

Section: Resultsmentioning

confidence: 99%

“…As shown in Figure 2 a, the stainless blade was inserted at the bonding interface, and the crack propagation length, L , was measured. The bonding energy, γ , between substrate 1 and substrate 2 is given by:

where t b is the thickness of the blade, t s is the thickness of the glass substrate, and E s is Young’s modulus [ 28 ]. As shown in Figure 2 b, the blade was inserted into the bonding interface between glass substrates, and the crack propagation length was measured.…”

Section: Methodsmentioning

confidence: 99%

“…Furthermore, the bonding of different types of glass has not been achieved. Previous studies have verified the low-temperature bonding of fused-silica glass substrates [ 23 , 24 , 25 , 28 ], which is identical to the glass material used for semiconductor fabrication. However, since microscope objective lenses are optimally designed for borosilicate cover glass (refractive index: 1.52), the use of micro/nanofluidic devices made of fused-silica glass (refractive index: 1.46) results in reduced spatial resolution during microscopic observation, as reported in a previous study [ 29 ].…”

Section: Introductionmentioning

confidence: 94%

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A Simple Low-Temperature Glass Bonding Process with Surface Activation by Oxygen Plasma for Micro/Nanofluidic Devices

et al. 2020

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The bonding of glass substrates is necessary when constructing micro/nanofluidic devices for sealing micro- and nanochannels. Recently, a low-temperature glass bonding method utilizing surface activation with plasma was developed to realize micro/nanofluidic devices for various applications, but it still has issues for general use. Here, we propose a simple process of low-temperature glass bonding utilizing typical facilities available in clean rooms and applied it to the fabrication of micro/nanofluidic devices made of different glasses. In the process, the substrate surface was activated with oxygen plasma, and the glass substrates were placed in contact in a class ISO 5 clean room. The pre-bonded substrates were heated for annealing. We found an optimal concentration of oxygen plasma and achieved a bonding energy of 0.33–0.48 J/m2 in fused-silica/fused-silica glass bonding. The process was applied to the bonding of fused-silica glass and borosilicate glass, which is generally used in optical microscopy, and revealed higher bonding energy than fused-silica/fused-silica glass bonding. An annealing temperature lower than 200 °C was necessary to avoid crack generation by thermal stress due to the different thermal properties of the glasses. A fabricated micro/nanofluidic device exhibited a pressure resistance higher than 600 kPa. This work will contribute to the advancement of micro/nanofluidics.

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Section: Resultsmentioning

confidence: 99%

Section: Methodsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 94%

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A Simple Low-Temperature Glass Bonding Process with Surface Activation by Oxygen Plasma for Micro/Nanofluidic Devices

et al. 2020

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“…It is worth noting that from the point of view of the bonding device, except for the method described in this article, other methods require specific devices to achieve bonding [23][24][25]. As for the bonding step, glass/glass [16], glass/PDMS, and PDMS/PDMS [18] require two steps for the bonding, while glass/silicon [14], PMMA/PMMA [15], and glass/polyurethane require only one step. From the perspective of bonding time [19], for all materials except glass/polyurethane, it takes 30 minutes or more.…”

Section: Comparison Of Bonding Methods Of Different Materialsmentioning

confidence: 99%

“…Remarkably, the simple bonding machine is used to implement the bonding of PMMA/PMMA [15], whereas the crack is more likely to happen owing to the lack of bonding strength. Dramatically, the bonding of glass/glass [16] compensates for the insufficiency of the former. A twostep bonding method including prebonding bonding and hot bonding is utilized to enhance the bonding strength.…”

Section: Introductionmentioning

confidence: 99%

A Rapid Bonding Method for Fabricating Mixing Microfluidic Chip Based on Micromachining Technology

WangJunyao

HouQi

LiuHuan

et al. 2020

Journal of Nanomaterials

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In this paper, a rapid bonding method is reported to fabricate a mixing microfluidic chip. The chip is composed of a glass upper plat and a polyurethane bottom plat. The upper plat with a microchannel is obtained through micromachining technology. And the bottom plat is manufactured via mixing the solution with the component of isocyanic acid and polyether polyol. The influence of the solution’s proportion on the contact angle and bonding force is investigated to enhance the hydrophilicity and the bonding strength. Furthermore, a mixing experiment is implemented to verify the chip’s bonding effect. The experimental results demonstrate that with increasing the proportions of isocyanic acid and polyether polyol, the contact angle and the bonding force increase at first and then decrease gradually. That is attributed to the variation of internal porous structure for different proportions. Considering the contact angle and the bonding force synthetically, the optimal proportion of 3.7 w/w is confirmed. The mixing efficiency is increased from 0.157 to 0.824. Compared with other bonding methods, the method in this paper has the advantages of high efficiency and high bonding strength.

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Flexible carbon nanocomposite fabric with negative permittivity property prepared by electrostatic spinning

Mu,

Sun,

Qin

et al. 2024

Adv Compos Hybrid Mater

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Recycled low-temperature direct bonding of Si/glass and glass/glass chips for detachable micro/nanofluidic devices

Cited by 25 publications

References 35 publications

A Simple Low-Temperature Glass Bonding Process with Surface Activation by Oxygen Plasma for Micro/Nanofluidic Devices

A Simple Low-Temperature Glass Bonding Process with Surface Activation by Oxygen Plasma for Micro/Nanofluidic Devices

A Rapid Bonding Method for Fabricating Mixing Microfluidic Chip Based on Micromachining Technology

Flexible carbon nanocomposite fabric with negative permittivity property prepared by electrostatic spinning

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