2011
DOI: 10.1143/jjap.50.04df06
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Reduced Contact Resistance and Improved Surface Morphology of Ohmic Contacts on GaN Employing KrF Laser Irradiation

Abstract: We employ excimer laser annealing for ohmic contact formation to n- and p-type GaN layers grown on sapphire substrates. The laser irradiation of the n-GaN layers led to increased nitrogen vacancies at the nitride surface, which promoted tunneling currents with a less resistive n-contact. For p-GaN layer, the laser irradiation increased the effective hole concentration that resulted in a reduced contact resistivity. The lowest specific contact resistance measured using the transmission line method was about 2.4… Show more

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Cited by 3 publications
(2 citation statements)
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“…So far, Ti/Al based metals, such as Ti/Al/Ni/Au and Ti/Al/Mo/Au, have been commonly used for ohmic contact to AlGaN/GaN materials. There have been three models proposed as a mechanism for ohmic contact formation using Ti/Al on AlGaN/GaN heterostructures: 7,8 (i) Ti reacts with N and forms Ti-N complex and/or N vacancies in AlGaN, acting as high density donor layer to form low resistive ohmic contact, 7,[9][10][11] (ii) barrier height at Ti and AlGaN interface is lowered by formation of Ti-N, 12,13 and (iii) alloyed Ti/Al layer makes a spike, which penetrates into AlGaN barrier layer and touches two dimensional electron gas (2DEG) at AlGaN/GaN interface. 7,8,14,15 However, there are several exceptions, for example, a low resistive ohmic contact is obtained by V (vanadium) instead of Ti 16 and a spike is not always observed in the ohmic contact.…”
mentioning
confidence: 99%
“…So far, Ti/Al based metals, such as Ti/Al/Ni/Au and Ti/Al/Mo/Au, have been commonly used for ohmic contact to AlGaN/GaN materials. There have been three models proposed as a mechanism for ohmic contact formation using Ti/Al on AlGaN/GaN heterostructures: 7,8 (i) Ti reacts with N and forms Ti-N complex and/or N vacancies in AlGaN, acting as high density donor layer to form low resistive ohmic contact, 7,[9][10][11] (ii) barrier height at Ti and AlGaN interface is lowered by formation of Ti-N, 12,13 and (iii) alloyed Ti/Al layer makes a spike, which penetrates into AlGaN barrier layer and touches two dimensional electron gas (2DEG) at AlGaN/GaN interface. 7,8,14,15 However, there are several exceptions, for example, a low resistive ohmic contact is obtained by V (vanadium) instead of Ti 16 and a spike is not always observed in the ohmic contact.…”
mentioning
confidence: 99%
“…Its operational lifetime and reliability are directly related to the energy supply of spacecraft, that is, the collector ring is the life line of the spacecraft [6]. Hence, the ECR is an essential parameter, which greatly affects the electrical transmission efficiency, long-lifetime operation and reliability of electrical equipment [7][8][9]. It is significantly vital developing a more accurate model to predict [10][11] and estimate the ECR during the design of the such electrical equipment.…”
Section: Introductionmentioning
confidence: 99%