We demonstrated the 1.1 μm-band 16 channel vertical cavity surface emitting laser (VCSEL) array for multi-core fiber (MCF) transmission towards co-packaged optics. Single-mode 16-ch top and bottom emitting VCSEL arrays were fabricated by either 3-inch or 6-inch wafer foundry process. The thermal crosstalk is estimated by wavelength shift. When the distance between adjacent VCSELs is 40 m, the total thermal crosstalk is as low as 7K. Bottom emitting metal-aperture VCSEL array were also fabricated via a full 3-inch wafer process. It shows low resistance and good single mode characteristic with an oxidation aperture of 7 μm thanks to an intra-cavity metal aperture. A large mode field diameter of 6 μm enables low coupling loss between bottom VCSEL array and MCF through a GaAs substrate for a flip-chip bonding process.