Reduced graphene oxide-wrapped Fe–Fe₃O₄@mSiO₂ hollow core–shell composites with enhanced electromagnetic wave absorption properties

Abstract

The Fe/Fe3O4 nanocomposite with mesoporous silica (mSiO2 for short) shell was successfully prepared by solvothermal reaction combined with hydrogen-thermal annealing (550 oC). Further, reduced graphene oxide (RGO) was introduced to...

Electromagnetic Absorption by Magnetic Oxide Nanomaterials: A Review

“…In a similar study, Yuanyuan Zhang et al prepared Fe/Fe 3 O 4 nanocomposites with mesoporous silica (mSiO 2 ) shells using solvothermal reaction combined with hydrogen thermal annealing. 125 Using the Fe−Fe 3 O 4 @mSiO 2 coating RGO as a filler, it achieved a minimum RL of −66.24 dB and an EAB of 5.31 GHz at a sample thickness of 1.79 mm. These findings demonstrate the potential of magnetic/dielectric composites in developing high-performance microwave absorption materials.…”

“…The optimized multilayer absorber exhibited remarkable absorption performance at 13.9 GHz, with an optimum RL of −50.2 dB and EAB of 5.1 GHz at 11.5 to 16.6 GHz. In a similar study, Yuanyuan Zhang et al prepared Fe/Fe 3 O 4 nanocomposites with mesoporous silica (mSiO 2 ) shells using solvothermal reaction combined with hydrogen thermal annealing . Using the Fe–Fe 3 O 4 @mSiO 2 coating RGO as a filler, it achieved a minimum RL of −66.24 dB and an EAB of 5.31 GHz at a sample thickness of 1.79 mm.…”

Iron Oxide/Magnesium Oxide/Graphene Oxide/Cellulose Composites with Superior Thermal Conductivity, EMI Shielding, and Electrical Insulation Synthesis Using Polydopamine Linker

“…Polymer-based composites have been extensively explored for this purpose. − However, enhancing the low thermal conductivity of polymers necessitates incorporating fillers with high thermal or electrical conductivity, including boron nitride (BN), − aluminum nitride (AlN), − Al 2 O 3 , − graphene oxide (GO), − and carbon nanotubes (CNTs). − Although these fillers improve the thermal or electrical conductivity, achieving both high EMI SE and the electrical insulation required by electronic packing materials remains difficult. To address this problem, we utilized magnetic particle fillers, , specifically Fe 3 O 4 and MgO nanoparticles.…”