Reduced lifetime of EUV pellicles due to defects

Transverse Deflection for Extreme Ultraviolet Pellicles

“…Simulations of pellicles and contaminant particles in pellicles were performed to examine mechanical and thermal deformations and crack time following thermal deformation with a finite element method (FEM) tool such as ANSYS. However, there was no mention about design or solver limitation [21,22]. This study reported solver limitation and locking phenomenon in commercial software types, such as ANSYS and SIEMENS, for transverse deflection of EUV pellicles with a 10 mm × 10 mm × 54-nm (thickness/width length (t/L) = 0.0000054) structure.…”

“…Figure 3 shows simulation results obtained using a Python program with an analyticalnumerical method [36] for EUV pellicles with a 10 mm × 10 mm × 54-nm structure. Simulation conditions were Young's modulus E = 169 × 10 9 Pa and Poisson's ratio v = 0.22 for polycrystalline silicon (p-Si), Young's modulus E = 454 × 10 9 Pa and Poisson's ratio v = 0.25 for ruthenium (Ru), Young's modulus E = 439.7 × 10 9 Pa and Poisson's ratio v = 0.17 for molybdenum silicide (MoSi 2 ), Young's modulus E = 410 × 10 9 Pa and Poisson's ratio v = 0.14 for silicon carbide (SiC), Young's modulus E = 50 × 10 9 Pa and Poisson's ratio v = 0.36 for tin (Sn), Young's modulus E = 295 × 10 9 Pa and Poisson's ratio v = 0.36 for zirconium disilicide (ZrSi 2 ), Young's modulus E = 300 × 10 9 Pa and Poisson's ratio v = 0.23 for silicon nitride (SiNx), number of approximations K = 5 (20 edge nodes), and a pressure range of 50~200 Pa [21]. Figure 3a,c present the three-dimensional plots of the maximum transverse deflection for SiNx rectangular plates of 10 mm × 10 mm × 54-nm and 10 mm × 10 mm × 540-nm, respectively.…”