Reducing device yield fallout at wafer level test with electrohydrodynamic (EHD) cleaning

Brož, Jan; Andersen, J.C.; Rincon, R.M.

doi:10.1109/test.2000.894240

Proceedings International Test Conference 2000 (IEEE Cat. No.00CH37159)

DOI: 10.1109/test.2000.894240

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Reducing device yield fallout at wafer level test with electrohydrodynamic (EHD) cleaning

Jan Brož

J.C. Andersen²,

R.M. Rincon³

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Reducing device yield fallout at wafer level test with electrohydrodynamic (EHD) cleaning

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References 3 publications

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