“…In these fine structures, however, when the surface of the fabricated active region is exposed to air, the resulting surface states easily cause carrier loss even if process-induced damage is completely removed. Hamao et al 8 found that when using flat AlGaAs/GaAs interfaces, in situ sample manipulation in an UHV environment restrained increase in nonradiative carrier recombination velocity, S, which severely occurred in the ex situ process. [1][2][3] In this context, in situ processing, where dry etching and crystal overgrowth are successively performed under ultrahigh vacuum ͑UHV͒ condition, is expected to provide processed/regrown interfaces with excellent quality owing to avoiding air-related contamination.…”