Reduction of copper surface oxide using a sub-atmospheric dielectric barrier discharge plasma

Udachin, Viktor; Wegewitz, Lienhard; Dahle, Sebastian; Maus‐Friedrichs, W.

doi:10.1016/j.apsusc.2021.151568

Cited by 14 publications

(16 citation statements)

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“…As it was shown in our previous research [9], few nanometer-thick native oxide layers were almost completely removed from copper surfaces within 20 s of treatment using a dielectric barrier discharge (DBD) plasma in an Ar/H 2 gas at 100 hPa. Such treatments showed efficient reduction of copper oxides at room temperature due to the presence of highly reactive atomic hydrogen radicals (H α ) in the plasma phase, but no change of morphology of surface was observed, which is a major advantage of this technique in comparison to the other methods like thermal annealing [9][10][11]. Nevertheless, practical implementation of an Ar/H 2 DBD plasma as a deoxidation pre-treatment step in metal fabrication processes might become complicated due to the fact that hydrogencontained mixtures are not preferable atmospheres in metal processing and manufacturing.…”

Section: Introductionmentioning

confidence: 57%

Section: Introductionmentioning

confidence: 81%

“…Among different techniques, non-thermal plasma reduction of copper oxides demonstrates promising results [4][5][6][7][8][9]. As it was shown in our previous research [9], few nanometer-thick native oxide layers were almost completely removed from copper surfaces within 20 s of treatment using a dielectric barrier discharge (DBD) plasma in an Ar/H 2 gas at 100 hPa. Such treatments showed efficient reduction of copper oxides at room temperature due to the presence of highly reactive atomic hydrogen radicals (H α ) in the plasma phase, but no change of morphology of surface was observed, which is a major advantage of this technique in comparison to the other methods like thermal annealing [9][10][11].…”

Section: Introductionmentioning

confidence: 81%

“…Interestingly, Feitknecht and co-authors characterized high frequency glow discharge plasma in pure SiH 4 with optical emission spectroscopy (OES) and observed SiH* and H α radicals in the plasma phase that were produced during dissociation of the SiH 4 gas [26]. Whereas SiH * is mainly considered to play a role in the formation of silicon-containing films, atomic hydrogen radicals H α are known to be effective in copper deoxidation [9,26,27]. Therefore, presence of such reactive species in the plasma phase makes SiH 4 plasmas also practical for metal deoxidation.…”

Section: Introductionmentioning

confidence: 99%

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Dielectric Barrier Discharge Plasma Deoxidation of Copper Surfaces in an Ar/SiH4 Atmosphere

Udachin

Wegewitz

Dahle

et al. 2022

Plasma Chem Plasma Process

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Nowadays, cold plasma techniques like dielectric barrier discharge (DBD) plasmas have attracted considerable interest in view of high deoxidation efficiencies as well as relative simplicity of setups. Although DBD plasma deoxidation of copper has been mainly studied in Ar/H2 mixtures, there is no information on reduction performance of such methods in other protective atmospheres. In this study, the reduction of natively oxidized copper surfaces using a DBD plasma in an Ar/SiH4 atmosphere at 100 hPa and 20 °C was investigated. The influence of a silane gas on the deoxidation performance was studied by varying the SiH4 concentration from 0.0 to 0.5 vol%. An addition of a SiH4 gas to an Ar atmosphere results in the increase of the deoxidation effect of a DBD plasma, so almost all Cu2O was reduced after 10 s of treatment in 0.1 vol% silane. Surface morphology analysis showed formation of particles after Ar/SiH4 plasma treatments that can be cleaned from the surfaces by wiping. Additionally, characterization of the plasma phase indicated the presence of SiH* radicals that likely play a role in the deoxidation effect. Moreover, an elimination of residual oxygen and nitrogen species in Ar by addition of SiH4 was observed.

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Section: Introductionmentioning

confidence: 57%

Section: Introductionmentioning

confidence: 81%

Section: Introductionmentioning

confidence: 81%

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Dielectric Barrier Discharge Plasma Deoxidation of Copper Surfaces in an Ar/SiH4 Atmosphere

Udachin

Wegewitz

Dahle

et al. 2022

Plasma Chem Plasma Process

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“…The DBD reactor has proven its ability to modify different substrates such as metal materials [ 15 , 16 ], wood or MDF boards [ 17 , 18 , 19 ], various polymeric materials used in the textile, food or electronics industries [ 20 , 21 , 22 , 23 ]. Many studies conducted in recent years have shown that treatment by means of an air DBD reactor at atmospheric pressure improves the properties of hydrophilicity, increases the surface tension of polymers, also changing the roughness of their substrates, and has the advantage of uniform and fast treatment of the entire surface [ 24 , 25 , 26 , 27 ].…”

Section: Introductionmentioning

confidence: 99%

Treatment of Polymeric Films Used for Printed Electronic Circuits Using Ambient Air DBD Non-Thermal Plasma

et al. 2022

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This study aims to present the properties of the polymeric films after being subjected to DBD plasma treatment in atmospheric conditions. Three different commercial films of polyester (Xerox Inkjet transparencies and Autostat CUS5 Clear film) and polycarbonate (Lexan™ 8010 MC) have been considered for the tests. The surface wettability has been evaluated based on static water contact angle (WCA) for different treatment times varying between 0.2 s and 30 s, the results revealing a maximum WCA decrease compared to a pristine of up to 50% for Xerox films, 75% for Autostat and 70% for Lexan. The persistence of the hydrophilic effect induced by the plasma treatment has also been verified for up to 72 h of storage after treatment, the results indicating a degradation of the treatment effects starting with the first hours after the treatment. The WCA stabilizes to a value inferior to the one corresponding to pristine in the first 24 h after plasma treatment. The adhesion forces, as well as preliminary surface morphology evaluations have been determined for the considered films using atomic force microscopy (AFM). The adhesion forces are increased together with the prolongation of the plasma treatment application time, varying from initial values of 165 nN, 58 nN and 204 nN to around 390 nN, 160 nN and 375 nN for Xerox, Autostat and Lexan films, respectively, after 5 s of DBD treatment. For the considered materials, the results revealed that the plasma treatment determines morphological changes of the surfaces indicating an increase in surface roughness.

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Determination of Cyclic Load Limits for Plasma‐Sprayed Copper Tracks on Material Extrusion‐Based Printed Surfaces

et al. 2022

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Herein, copper particles are deposited on additively manufactured surfaces and investigations are performed to determine the mechanical properties and the impact of copper tracks on the surfaces. The basic investigation covers quasistatic tests, namely, tensile and three point bending, for three different printing orientations and two infill variations (þ45°/À45°and 0°/90°), which shows no remarkable differences. In addition, a copper track is sprayed via atmospheric pressure plasma spraying (APPS) onto the polymeric samples and characterized regarding hardness and electric conductivity. Furthermore, a specific application for the copper track on the polymer substrate is recreated by a cyclic three point bending with a novel sample geometry (T-shaped). The sprayed copper track has 60% of the hardness and 40% of the indentation modulus of bulk copper. Depending on the substrates' topography, the electric conductivity varies from 7% to 18% of bulk copper. The lifetime of the copper track (i.e., conductivity) is strongly dependent on the deformation and the fracture of the polymer underneath. The underlying failure mechanism is triggered either by the topography of the polymer substrate or as a consequence of the damage in the copper track, leading to superficial cracks in the polymer surface.

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Reduction of copper surface oxide using a sub-atmospheric dielectric barrier discharge plasma

Cited by 14 publications

References 50 publications

Dielectric Barrier Discharge Plasma Deoxidation of Copper Surfaces in an Ar/SiH4 Atmosphere

Dielectric Barrier Discharge Plasma Deoxidation of Copper Surfaces in an Ar/SiH4 Atmosphere

Treatment of Polymeric Films Used for Printed Electronic Circuits Using Ambient Air DBD Non-Thermal Plasma

Determination of Cyclic Load Limits for Plasma‐Sprayed Copper Tracks on Material Extrusion‐Based Printed Surfaces

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