Reduction of internal stress in SU-8 photoresist layer by ultrasonic treatment

Du, Liqun; Wang, Qijia; Zhang, Xiaolei

doi:10.1007/s11431-010-4136-8

Cited by 13 publications

(6 citation statements)

References 12 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…This fact indicates the effectiveness of the ATZ cavities in reduction of thermal stress by decreasing contact surface between SU-8 and glass. Some alternatives for reducing thermal stress further are: (1) low bake temperatures 36 37 , (2) doping of the resist based on nanoparticles of SiO 2 38 , and (3) treatment in ultrasound 39 .…”

Section: Resultsmentioning

confidence: 99%

Sacrificial adhesive bonding: a powerful method for fabrication of glass microchips

Lima

Leão

Piazzetta

et al. 2015

Sci Rep

View full text Add to dashboard Cite

A new protocol for fabrication of glass microchips is addressed in this research paper. Initially, the method involves the use of an uncured SU-8 intermediate to seal two glass slides irreversibly as in conventional adhesive bonding-based approaches. Subsequently, an additional step removes the adhesive layer from the channels. This step relies on a selective development to remove the SU-8 only inside the microchannel, generating glass-like surface properties as demonstrated by specific tests. Named sacrificial adhesive layer (SAB), the protocol meets the requirements of an ideal microfabrication technique such as throughput, relatively low cost, feasibility for ultra large-scale integration (ULSI), and high adhesion strength, supporting pressures on the order of 5 MPa. Furthermore, SAB eliminates the use of high temperature, pressure, or potential, enabling the deposition of thin films for electrical or electrochemical experiments. Finally, the SAB protocol is an improvement on SU-8-based bondings described in the literature. Aspects such as substrate/resist adherence, formation of bubbles, and thermal stress were effectively solved by using simple and inexpensive alternatives.

show abstract

Section: Resultsmentioning

confidence: 99%

Sacrificial adhesive bonding: a powerful method for fabrication of glass microchips

Lima

Leão

Piazzetta

et al. 2015

Sci Rep

View full text Add to dashboard Cite

show abstract

“…With the wide application of power ultrasound in advanced machining fields, sandwich piezoelectric transducers are valued and studied in ultrasonic milling [ 1 , 2 ], ultrasonic casting [ 3 , 4 ], and ultrasonic vibration for machining residual stress removal [ 5 , 6 , 7 , 8 , 9 ] because of their good electromechanical conversion characteristics. Although the structure and performance of piezoelectric ceramic transducers for different ultrasonic processing fields are not consistent, the inherent frequency of sandwich piezoelectric transducers is the most important performance parameter, which is the key to achieving high power output and high-efficiency energy conversion in practical applications.…”

Section: Introductionmentioning

confidence: 99%

Research on Inherent Frequency and Vibration Characteristics of Sandwich Piezoelectric Ceramic Transducer

Pan

et al. 2022

Sensors

View full text Add to dashboard Cite

Great progress has been made in the field of ultrasonic processing in recent years, and piezoelectric ceramic transducers have been widely used as drive sources. In this paper, a sandwich piezoelectric ceramic transducer is designed, and the vibration of each part of the transducer is analyzed by elastic mechanics and piezoelectric theory. According to its mechanical and electrical boundary conditions, the vibration model of the piezoelectric transducer was established. Based on the equivalent elastic modulus method for simplifying the pre-stressed bolts into a one-dimensional transducer vibration model, the relationship between the one-dimensional axial response frequency of the transducer and the length of each component was obtained. Based on the half wavelength theory, a transducer with the vibration node in the crystal stack and an inherent frequency of 15 kHz was designed and fabricated. In order to verify the natural frequency and vibration characteristics of the piezoelectric transducer, a laser vibration measurement system was built in this study. The vibration characteristics of the transducer under different parameters such as voltage and frequency were analyzed, and the accuracy of the vibration model was verified. The vibration states of the end surface of the transducer and the radial surface were evaluated at the first-order inherent frequency and second-order inherent frequency. The results show that the equivalent simplified model established in this study can effectively design the inherent frequency of the transducer, and the operation at the first-order inherent frequency meets the one-dimensional assumptions of this study. The transducer operating conditions measured in this study also provide a more detailed reference for ultrasonic processing applications.

show abstract

“…(2) Cross-linking networks homogenization: the stacking cross-linking networks loose or separate under the action of dynamic stresses. (3) Local failure of cross-linking networks: the molecular chains will be locally damaged and a new stable state will be formed when networks absorb enough vibration energy [11][12][13].…”

Section: Introductionmentioning

confidence: 99%

“…Vibration aging has been widely used in the residual stresses elimination of welding parts due to its advantages of strong adaptability, good economic benefits and aging effects [9,10]. As far as is know, there is almost no report about vibration aging used in residual stresses elimination for micro-scale photoresist film except the information given in Du's references [11]. However, all the experiments included in thesewere carried out under a fixed excitation frequency(20 kHz), which greatly affected the impacts of vibration aging.…”

Section: Introductionmentioning

confidence: 99%

Research on the effects of high frequency vibration aging on a micro-scale polymer AZ4620 photoresist film

Yang¹,

Zheng²,

Zhang³

et al. 2016

J. Micromech. Microeng.

View full text Add to dashboard Cite

In order to research the effects of vibration aging on micro-scale thin films, a high frequency vibration system is designed for the aging of a polymer AZ4620 photoresist film. The profile method is adopted to predict the residual stresses in the film. A laser measuring device is constructed to measure the sample profiles in the experiment. The excitation frequencies for vibration aging are determined using the finite element method. The effects of vibration parameters on aging results are studied, such as excitation frequency, vibration aging time, exciting power and vibration acceleration. Results show that the more vibration nodes that existed in sample's inherent mode, the better vibration aging results can be obtained under this excitation frequency. Under the excitation frequency of 6932 Hz and excitation current 5 A, and vibration aging for only 14 min, the residual stress elimination rate already reached 51.52%.

show abstract

Reduction of internal stress in SU-8 photoresist layer by ultrasonic treatment

Cited by 13 publications

References 12 publications

Sacrificial adhesive bonding: a powerful method for fabrication of glass microchips

Sacrificial adhesive bonding: a powerful method for fabrication of glass microchips

Research on Inherent Frequency and Vibration Characteristics of Sandwich Piezoelectric Ceramic Transducer

Research on the effects of high frequency vibration aging on a micro-scale polymer AZ4620 photoresist film

Contact Info

Product

Resources

About