Reduction of squeeze-film damping in a wafer-level encapsulated RF MEMS DC shunt switch

Ke, Feixiang; Miao, Jianmin; Tan, Chin Wen

doi:10.1016/j.sna.2011.07.015

Cited by 4 publications

(1 citation statement)

References 11 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…the additional structures, like sheet, on the vibrating structures, and left thin air layer between them for the air squeezed and vibrated which dissipate the vibrating energy on the paths of vibrating wave propagation. The AFD has been applied to MEMS [5][6][7] and squeeze film air bearing [8] recent years. Compared with LVD, AFD is easier to be mounted in some bad environments (cold and high temperature, oil, acid or salt), and maybe bring more impact acceleration and instability (especially under heavy excitation) on the other hand.…”

Section: Introductionmentioning

confidence: 99%

Experiment on Vibration Reducing Capacities of Pore Viscous Damping and Liquid Film Damping

Zhao

Zhu

et al. 2012

AMR

View full text Add to dashboard Cite

Recently, we develop a new method for reducing vibration named liquid film damping (LFD) which combines the mechanism of vibrational energy dissipation of liquid viscous damping (LVD) and air film damping (AFD). This paper use experiment to compare the capacities of vibration decreasing of LFD and the pore viscous damping (PVD) which is an extensive applied type of LVD. The results of experiment present LFD has better ability than traditional LVD in reducing vibration of structures in not only higher frequency but lower frequency.

show abstract

Section: Introductionmentioning

confidence: 99%