“…Also in the Ref. 19, it shows that the amount of ceria dissolved decreases as the temperature drops, nevertheless, a small amount of dissolution still occurred at 37 °C, which is the same as pointed out in this work that ceria can still dissolve even at 20 °C.…”
Section: Discussionsupporting
confidence: 89%
“…Obviously, without adding U(IV), the Ea for the HNO 3 dissolution of ceria should be much higher than 40 KJ mol − . 19 In our work, it is found that the NPM (containing 2% HNO 3 (0.3 M) and 10% H 2 O 2 ) at 80 °C can completely dissolve the ceria particles contaminated on the SiO 2 substrate either by B20 ceria particles in 4 min or by A90 ceria particles in 20 min. In order to compare the dissolution rate of ceria by NPM with that by HNO 3 in Ref.…”
Section: Discussionmentioning
confidence: 56%
“…The ceria dissolution reaction has been investigated by Um et al by using H 2 SO 4 , 18 and Dhamodharan et al by using HNO 3 and HNO 3 with a reductant agent U(IV). 19 The ceria dissolution process can be described by a shrinking core model, and it is reaction controlled instead of diffusion controlled. The Arrhenius equation is written as:…”
Section: Discussionmentioning
confidence: 99%
“…In order to compare the dissolution rate of ceria by NPM with that by HNO 3 in Ref. 19, a solution consisting of 5 M mol −1 HNO 3 and 10 wt% H 2 O 2, was used to dissolve the A90 ceria particles at 80 °C, and the obtained dissolution rate was 20-23 mg min −1 , higher than that in 5 M HNO 3 with reducing agent U(IV). It can be deduced that the Ea of the ceria dissolution by NPM should be lower than 40 KJ mol −1 .…”
It is difficult to remove nanoceria abrasives from the SiO2 substrate after the shallow trench isolation (STI) chemical mechanical polishing process. In this work, we studied the cleaning behavior of ceria particles by using an acidic cleaning solution instead of normal sulfuric acid and hydrogen peroxide mixture solution (SPM) at high temperatures (above 85℃) and low temperatures (below 30℃). The solution, named as NPM, consists of HNO3 (1-2 vol%), H2O2 (5-10 vol %), and deionized water (DIW). It is found that NPM may dis-solve nanoceria particles at high temperatures with higher cleaning efficiency (CE) than that of SPM. NPM can clean the A90 (90 nm ceria) particles under ultrasonic/megasonic at low temperatures, while SPM has poor CE at 20℃. The redox reaction of NPM and its effect on cleaning mechanism were systematically studied.
“…Also in the Ref. 19, it shows that the amount of ceria dissolved decreases as the temperature drops, nevertheless, a small amount of dissolution still occurred at 37 °C, which is the same as pointed out in this work that ceria can still dissolve even at 20 °C.…”
Section: Discussionsupporting
confidence: 89%
“…Obviously, without adding U(IV), the Ea for the HNO 3 dissolution of ceria should be much higher than 40 KJ mol − . 19 In our work, it is found that the NPM (containing 2% HNO 3 (0.3 M) and 10% H 2 O 2 ) at 80 °C can completely dissolve the ceria particles contaminated on the SiO 2 substrate either by B20 ceria particles in 4 min or by A90 ceria particles in 20 min. In order to compare the dissolution rate of ceria by NPM with that by HNO 3 in Ref.…”
Section: Discussionmentioning
confidence: 56%
“…The ceria dissolution reaction has been investigated by Um et al by using H 2 SO 4 , 18 and Dhamodharan et al by using HNO 3 and HNO 3 with a reductant agent U(IV). 19 The ceria dissolution process can be described by a shrinking core model, and it is reaction controlled instead of diffusion controlled. The Arrhenius equation is written as:…”
Section: Discussionmentioning
confidence: 99%
“…In order to compare the dissolution rate of ceria by NPM with that by HNO 3 in Ref. 19, a solution consisting of 5 M mol −1 HNO 3 and 10 wt% H 2 O 2, was used to dissolve the A90 ceria particles at 80 °C, and the obtained dissolution rate was 20-23 mg min −1 , higher than that in 5 M HNO 3 with reducing agent U(IV). It can be deduced that the Ea of the ceria dissolution by NPM should be lower than 40 KJ mol −1 .…”
It is difficult to remove nanoceria abrasives from the SiO2 substrate after the shallow trench isolation (STI) chemical mechanical polishing process. In this work, we studied the cleaning behavior of ceria particles by using an acidic cleaning solution instead of normal sulfuric acid and hydrogen peroxide mixture solution (SPM) at high temperatures (above 85℃) and low temperatures (below 30℃). The solution, named as NPM, consists of HNO3 (1-2 vol%), H2O2 (5-10 vol %), and deionized water (DIW). It is found that NPM may dis-solve nanoceria particles at high temperatures with higher cleaning efficiency (CE) than that of SPM. NPM can clean the A90 (90 nm ceria) particles under ultrasonic/megasonic at low temperatures, while SPM has poor CE at 20℃. The redox reaction of NPM and its effect on cleaning mechanism were systematically studied.
“…The dissolution of ceria in nitric acid is controlled by chemical reaction and not by diffusion as the dissolution rate did not change with the mixing rate. 244…”
Section: Physicochemical Properties Of Ceria Nanoparticlesmentioning
Cerium oxide nanoparticles (CeNPs) are versatile materials with unique and unusual properties that vary depending on their surface chemistry, size, shape, coating, oxidation states, crystallinity, dopant, structural and surface defects....
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