Reflective grazing incidence EUV nanoscope for wafer metrology

Shen, Tao; Ekinci, Yasin; Mochi, Iacopo

doi:10.1117/12.2641776

Cited by 4 publications

(1 citation statement)

References 11 publications

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“…In order to provide an comprehensive metrology platform, and to explore the potential of coherent diffraction imaging (CDI) for wafer metrology, we are developing a prototype platform, REGINE, the reflective grazing incidence nanoscope for EUV. 4…”

Section: Introductionmentioning

confidence: 99%

EUV grazing-incidence lensless imaging wafer metrology

Shen

Ansuinelli

Mochi

et al. 2023

Metrology, Inspection, and Process Control XXXVII

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Non-destructive metrology for photomasks and wafers has always been an important requirement for semiconductor lithography, and with the advent of EUVL, enabling further shrinkage of semiconductor devices, the challenges in this field have increased significantly. Coherent diffraction imaging (CDI) is a promising alternative to standard imaging for EUV photomask actinic inspection. EUV light can also be used for wafer inspection to benefit from the resolution improvement allowed by its short wavelength. In order to perform lensless imaging for patterned wafers, however, we need to probe the sample surface at grazing incidence to ensure a sufficiently high reflectance. The EUV reflective grazing incidence nanoscope (REGINE) at the Swiss Light Source was develped to perform grazing incidence lensless imaging for patterned wafers. REGINE is a tool that combines CDI, scatterometry and reflectometry in the photon energy range between 80 to 200 eV, and at the grazing incidence angle of 1 to 28 degrees. In this work, we will present the latest characterization of our system, and preliminary results.

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Section: Introductionmentioning

confidence: 99%

EUV grazing-incidence lensless imaging wafer metrology

Shen

Ansuinelli

Mochi

et al. 2023

Metrology, Inspection, and Process Control XXXVII

View full text Add to dashboard Cite

show abstract

Spectral reflectometry characterization of an extreme ultraviolet attenuated phase-shifting mask blank

Shen,

Mochi,

Jeong

et al. 2024

J. Micro/Nanopattern. Mats. Metro.

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EUV reflective coherent diffraction imaging system for wafer metrology

Shen

Ansuinelli

Mochi

et al. 2023

Optical Measurement Systems for Industrial Inspection XIII

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Nanoscale non-destructive metrology is a key requirement in several steps of the manufacturing process of modern semiconductor devices. In particular, with the introduction of EUV lithography into the high-volume manufacturing, enabling further shrinking of feature sizes, metrology for future technology nodes will become increasingly challenging. Depending on the specific requirements and constraints of the metrology tasks, the choice of the measurement methods is critical, and sometimes limited. Conventional metrology techniques must be constantly adapted to keep up with the device scaling roadmap. To explore new and easily scalable methods for semiconductor wafer metrology, we developed the EUV reflective grazing-incidence nanoscope (REGINE). REGINE is a lensless nanoscope prototype that combines reflectometry, scatterometry and coherent diffraction imaging (CDI) in a single instrument. Being a lensless imaging system, it is compact, cost-effective, and free of lens-induced aberrations. In this work, we will present the REGINE system and the latest results of reflectometry, scatterometry and EUV pellicle transmission experiments.

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Reflective grazing incidence EUV nanoscope for wafer metrology

Cited by 4 publications

References 11 publications

EUV grazing-incidence lensless imaging wafer metrology

EUV grazing-incidence lensless imaging wafer metrology

Spectral reflectometry characterization of an extreme ultraviolet attenuated phase-shifting mask blank

EUV reflective coherent diffraction imaging system for wafer metrology

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