Reflow discoloration formation on pure tin (Sn) surface finish

Xu, Zhong; Sun, Hongqi; He, Yang; Qu, Xin-Ping

doi:10.1016/j.microrel.2012.01.011

Cited by 4 publications

(2 citation statements)

References 6 publications

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“…In response to the prohibition of lead (Pb) containing materials by the Restriction of Hazardous Substances (RoHS) Directive, pure tin (Sn) is widely adopted for the surface finishing of electronic devices 9 . Meanwhile, Sn-based Pb-free solder alloys are widely employed as solder interconnects in electronic devices 2 , 10 , 11 .…”

Section: Introductionmentioning

confidence: 99%

In-situ study of electrochemical migration of tin in the presence of bromide ion

Lee

Haseeb

Basirun

et al. 2021

Sci Rep

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The miniaturization of electronic devices and the consequent decrease in the distance between conductive lines have increased the risk of short circuit failure due to electrochemical migration (ECM). The presence of ionic contaminants affects the ECM process. This work systematically investigates the ECM of tin (Sn) in the presence of bromide ions (Br−) in the range of 10−6 M to 1.0 M. Water drop test (WDT) was conducted in the two-probe semiconductor characterization system under an optical microscope as an in-situ observation. Polarization test was carried out to study the correlation between the corrosion properties of Sn and its ECM behaviour. The products of ECM were characterized by scanning electron microscope coupled with an energy dispersive X-rays spectrometer (SEM/EDX) and X-ray photoelectron spectrometer (XPS). The results confirm that the rate of anodic dissolution of Sn monotonously increases with the Br− concentration. However, the probability of ECM failure follows a normal distribution initially, but later increases with the Br− concentration. The main products of the ECM reactions are identified as Sn dendrites and tin hydroxide precipitates. The mechanisms of the ECM process of Sn in the presence of Br− are also suggested.

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Section: Introductionmentioning

confidence: 99%

In-situ study of electrochemical migration of tin in the presence of bromide ion

Lee

Haseeb

Basirun

et al. 2021

Sci Rep

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“…For example, the presence of the impurities within the deposits may cause an increase of resistivity for interconnects in an integrated circuit, 2,3 a detrimental deterioration of the corrosion and magnetic properties, 4 formation of tin whiskers 5 and a surface discoloration for tin deposits. 6 The additives may contain different functional groups with the elements of S, N and O which are usually capable of adsorption on the cathodic surface. Hence, the incorporation of the additives in the deposit is often a consequence of the presence of the adsorbates at the surface of the cathode.…”

mentioning

confidence: 99%

Effects of the Intermolecular Interactions between Phthalic Acid and Surfactants on Electrodeposition of Tin

Hua

Wang

Shi

et al. 2014

J. Electrochem. Soc.

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The effect of intermolecular interaction of Phthalic acid (PA) and nonionic surfactants on electrodeposition was studied and the electrodeposition of tin was used as a model system. The CV curve of the electrolyte in the presence of a combination of PA and Triton X-100 (TX100) indicates that a relatively compact adlayer forms on the electrode surface and the electrodeposition of tin is inhibited very well. It is expected that the aromatic character of the hydrophobic moiety of both TX100 and PA enhance the binding interaction and the blocking effect is governed by the intermolecular interaction between PA and TX100. Scanning electron microscopic (SEM) image shows that a smooth, regular and compact deposit was obtained from the electrolyte with both PA and TX100. A relatively low carbon content of the deposit indicates that the incorporation of the additive in a deposit is strongly controlled in the presence of both PA and TX100. The possible explanation for the reduced incorporation may be proposed as the formation of the linkage of the molecules caused by intermolecular interaction between PA and TX100.

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Effect of Organic Plating Additives Concentration on Carbon Content and Donor Density of Electroplated Tin

Fabro

Mena

2019

IOP Conf. Ser.: Mater. Sci. Eng.

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Pure tin is widely used as a replacement of Pb-Sn eutectic alloy as finish and solder material. This study aims to determine how the increasing concentration of organic plating additives affects the carbon content and donor density of electroplated Sn. Pure tin was electroplated on an Al sheet in a Hull cell using a commercial plating solution. Plating was performed in electrolyte baths with primary additive concentration from 100 mL/L to 600 mL/L, and with secondary additive concentration from 8 mL/L to 48 mL/L. Current densities of 15, 8 and 3 A/dm2 were considered. The increased concentration of organic plating additives caused an increase in carbon content of the deposit from 5 wt.% C to 8 wt.%C. Mott-Schottky measurements showed increasing electron donor density of up to four orders of magnitude as a function of current density and carbon content. A higher current density during deposition causes the tin oxide film to reach the donor density saturation value at lower concentrations of organic plating additives. This suggests that current plays a role in the decomposition of organic additives, which results in the incorporation of carbon in the deposit.

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Reflow discoloration formation on pure tin (Sn) surface finish

Cited by 4 publications

References 6 publications

In-situ study of electrochemical migration of tin in the presence of bromide ion

In-situ study of electrochemical migration of tin in the presence of bromide ion

Effects of the Intermolecular Interactions between Phthalic Acid and Surfactants on Electrodeposition of Tin

Effect of Organic Plating Additives Concentration on Carbon Content and Donor Density of Electroplated Tin

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