Regularities of low-valency intermediate accumulation during a step-wise electrode process

Molodov, A. I.; Markos'yan, G. N.; Losev, V. V.

doi:10.1016/0013-4686(72)80071-9

Cited by 29 publications

(29 citation statements)

References 14 publications

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“…It was suggested by Zeidler et al [45,48,[50][51][52][53], Nguyen et al [49], Wang et al [40] and Kondo et al [46] that this observation was a result of copper passivation. Similar explanation was suggested by Molodov et al [57], describing copper behavior in HClO 4 -H 2 O 2 media. It was also assumed that copper passivity is provided by OH radicals absorbed at the copper surface [57].…”

Section: Peroxide Based Cmp Slurriessupporting

confidence: 56%

“…Similar explanation was suggested by Molodov et al [57], describing copper behavior in HClO 4 -H 2 O 2 media. It was also assumed that copper passivity is provided by OH radicals absorbed at the copper surface [57]. Copper passivation due to the formation of oxide film in peroxide solutions was also reported by Hernandez et al [48], Hirabayashi et al [58] and Paul et al [63].…”

Section: Peroxide Based Cmp Slurriessupporting

confidence: 56%

“…Its reduction is considered to be "clean"; it is accompanied only with oxygen and hydrogen evolution, hydroxide-ions and water are formed. This advantage drives the development of slurries based only water and hydrogen peroxide [50][51][52][53][54][55][56][57][58]. It should be noted that the use of oxygen as the oxidizer in CMP slurry was investigated by DeNardis et al [59].…”

Section: Peroxide Based Cmp Slurriesmentioning

confidence: 99%

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Review on copper chemical–mechanical polishing (CMP) and post-CMP cleaning in ultra large system integrated (ULSI)—An electrochemical perspective

Ein‐Eli

Starosvetsky

2007

Electrochimica Acta

174

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Section: Peroxide Based Cmp Slurriessupporting

confidence: 56%

Section: Peroxide Based Cmp Slurriessupporting

confidence: 56%

Section: Peroxide Based Cmp Slurriesmentioning

confidence: 99%

See 1 more Smart Citation

Review on copper chemical–mechanical polishing (CMP) and post-CMP cleaning in ultra large system integrated (ULSI)—An electrochemical perspective

Ein‐Eli

Starosvetsky

2007

Electrochimica Acta

174

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“…where i I and i II are the charge-transfer controlled current densities of the two consecutive electrochemical reaction steps [24][25][26][27][28] …”

Section: Resultsmentioning

confidence: 99%

The Influence of Halide Ions on the Kinetics of Electrochemical Copper(II) Reduction

Doblhofer¹,

Wasle²,

Soares³

et al. 2003

Zeitschrift Für Physikalische Chemie

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Electrochemistry / Copper / Halides / Mechanism / Electroplating / ElectrorefiningThe cathodic reduction of copper(II) in an electrolyte comparable to technical conditions (2.2 M H 2 SO 4 + 0.3 M CuSO 4 ) is markedly affected by the presence of small concentrations of halide ions. Chloride ions accelerate the reaction, while it is slowed down by bromide. Experiments in which cyclic voltammetry is combined with an electrochemical quartz-crystal microbalance reveal the deposition and dissolution of crystalline CuCl or CuBr, respectively, on the copper surface. At the technically relevant more negative electrode potentials bulk CuCl and CuBr are unstable, however halide ions are adsorbed on the copper electrode. Although there is evidence for adsorption of the reacting Cu(II) species at the electrode surface, up to a concentration of 0.3 M CuSO 4 in presence as well as in absence of adsorbed halogenide, there is no evidence for limiation of the reaction rate caused by a limited coverage of the surface with this species.

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“…The corrosion of copper in a naturally aerated solution of 0.5 M H 2 SO 4 proceeds via a catalytic mechanism, in which the oxygen reduction occurs predominantly in a chemical reaction, which facilitates the process of the reduction of the oxidant; the self-dissolution of copper is associated mainly with the regeneration of Cu + ; and the entire process is described by the following reactions [1][2][3][4][5][6][7]:…”

Section: Introductionmentioning

confidence: 99%

Copper Dissolution Rate as a Function of the Corroding-Surface Tilt

Miečinskas¹

2005

Russ J Electrochem

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Measurements of the copper corrosion rate in 0.5 M H 2 SO 4 as a function of the tilt angle of the corroding electrode surface in the gravitational field show that the downward flux of natural convection (NC), which arises during corrosion, effects the process similarly to NC that arises when electrochemical reactions proceed in a diffusion kinetics mode. The corrosion rate of a horizontal face-down electrode is 2.3 times that when facing up. Without NC, when a horizontal face-up copper electrode is in a recess, its corrosion rate is defined by the oxygen diffusion current and is 12-28 times as small as that with NC next to its surface.

show abstract

Regularities of low-valency intermediate accumulation during a step-wise electrode process

Cited by 29 publications

References 14 publications

Review on copper chemical–mechanical polishing (CMP) and post-CMP cleaning in ultra large system integrated (ULSI)—An electrochemical perspective

Review on copper chemical–mechanical polishing (CMP) and post-CMP cleaning in ultra large system integrated (ULSI)—An electrochemical perspective

The Influence of Halide Ions on the Kinetics of Electrochemical Copper(II) Reduction

Copper Dissolution Rate as a Function of the Corroding-Surface Tilt

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