“…The average separation of Cu I ···Cu I bonding motifs reached 2.71 Å, which was within the reasonable distance range of “cuprophilic” closed-shell interactions , (van der Waals radius of copper is 2.80 Å). As depicted in Figure c and Table S2, Cu1 connected with Cu2, Cu3, and Cu4 through strong metal–metal bonding interactions with a shorter separation of 2.762(6), 2.533(8), and 2.543(7) Å, respectively, in the [(Cu 5 I 8 ) 3– ]-type zigzag chain backbone. − Three four-coordinated copper atoms (Cu2, Cu3, and Cu4) formed a triangle motif multiply bridged by six bridging iodides (I2–I7). The terminal three-coordinated Cu5 was supported by three iodides (μ 3 -I6, μ 2 -I7, and I8), and the separation between Cu4 and Cu5 reached 3.067 Å.…”