Regulating interface adhesion and enhancing thermal conductivity of diamond/copper composites by ion beam bombardment and following surface metallization pretreatment

Sang, Jianquan; Yang, Wulin; Zhu, Jiajun; Fu, Licai; Li, Deyi; Zhou, Lingping

doi:10.1016/j.jallcom.2018.01.078

Cited by 40 publications

(8 citation statements)

References 31 publications

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“…Here, we compared our results with the previous studies (Fig. 5(b)) [7,8,[60][61][62][63][64][65][9][10][11][12][13][57][58][59]. Since the thermal conductivity is particularly sensitive to the diamond size and volume fraction, which are critical for deciding the material cost, although the highest experimentally achieved thermal conductivity is around 900 W/m-K [11], it is only meaningful to compare the performance of the composite fabricated with similar diamond volume fraction and size within a similar range.…”

Section: (G)-(h))mentioning

confidence: 88%

Scalable monolayer-functionalized nanointerface for thermal conductivity enhancement in copper/diamond composite

Hung

et al. 2021

Carbon

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Section: (G)-(h))mentioning

confidence: 88%

Scalable monolayer-functionalized nanointerface for thermal conductivity enhancement in copper/diamond composite

Hung

et al. 2021

Carbon

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“…The substrate pretreatment procedure ( Figure 1 b) proved to be one of the main factors affecting the properties of metal films and tracks, including adhesion and conductivity [ 13 , 49 , 50 ]. The laser-induced synthesis with a plain glass substrate ( Figure 1 a) resulted in the fabrication of copper structures with poor adhesion, and with an unstable value of resistance.…”

Section: Resultsmentioning

confidence: 99%

Direct Laser Writing of Copper Micropatterns from Deep Eutectic Solvents Using Pulsed near-IR Radiation

et al. 2022

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In this study, we developed a method for the fabrication of electrically conductive copper patterns of arbitrary topology and films on dielectric substrates, by improved laser-induced synthesis from deep eutectic solvents. A significant increase in the processing efficiency was achieved by acceptor substrate pretreatment, with the laser-induced microplasma technique, using auxiliary glass substrates and optional laser post-processing of the recorded structures; thus, the proposed approach offers a complete manufacturing cycle, utilizing a single, commercially available, pulsed Yb fiber laser system. The potential implications of the presented research are amplified by the observation of laser-induced periodic surface structures (LIPSSs) that may be useful for the further tuning of tracks’ functional properties.

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“…Thermal stress originates from a mismatch of the coefficients of thermal expansion (CTEs) between the heat sink material and the chip during the packaging and working state. It is necessary to solve the influence of alternating stresses caused by temperature changes Metals 2021, 11,196. https://doi.org/10.3390/met11020196 https://www.mdpi.com/journal/metals on the reliability and normal working conditions of devices [2].…”

Section: Introductionmentioning

confidence: 99%

“…Additionally, Chen et al [10] illustrated that the obtained composites exhibited TC values as low as 200 W m −1 K −1 by a high-pressure high-temperature powder metallurgy (HPHT-PM) method. Sang et al [11] produced a low TC (approximately 114 W m −1 K −1 ) for an uncoated diamond/copper composite fabricated by an infiltration method. Now, the method of coating the diamond particle surface with carbide-forming elements has been widely used to reduce the interface thermal resistance between diamond and Cu before the preparation of diamond/Cu composites [12,13].…”

Section: Introductionmentioning

confidence: 99%

The Interface and Fabrication Process of Diamond/Cu Composites with Nanocoated Diamond for Heat Sink Applications

Zhou

et al. 2021

Metals

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The coefficients of thermal expansion (CTE) and thermal conductivity (TC) are important for heat sink applications, as they can minimize stress between heat sink substrates and chips and prevent failure from thermal accumulation in electronics. We investigated the interface behavior and manufacturing of diamond/Cu composites and found that they have much lower TCs than copper due to their low densities. Most defects, such as cavities, form around diamond particles, substantially decreasing the high TC of diamond reinforcements. However, the measurement results for the Cu-coated diamond/Cu composites are unsatisfactory because the nanosized copper layer on the diamond surface grew and spheroidized at elevated sintering temperatures. Realizing ideal interfacial bonding between a copper matrix and diamond particles is difficult. The TC of the 40 vol.% Ti-coated diamond/Cu composite is 475.01 W m−1 K−1, much higher than that of diamond/Cu and Cu-coated diamond/Cu composites under equivalent manufacturing conditions. The minimally grown titanium layer retained its nanosized and was consistent with the sintering temperature. Depositing a nanosized titanium layer on a diamond surface will strengthen interfacial bonding through interface reactions among the copper matrix, nanosized titanium layer and diamond particles, reducing the interfacial thermal resistance and exploiting the high TC of diamond particles, even if defects from powder metallurgy remain. These results provide an important experimental and theoretical basis for manufacturing diamond/Cu composites for heat sink applications.

show abstract

Regulating interface adhesion and enhancing thermal conductivity of diamond/copper composites by ion beam bombardment and following surface metallization pretreatment

Cited by 40 publications

References 31 publications

Scalable monolayer-functionalized nanointerface for thermal conductivity enhancement in copper/diamond composite

Scalable monolayer-functionalized nanointerface for thermal conductivity enhancement in copper/diamond composite

Direct Laser Writing of Copper Micropatterns from Deep Eutectic Solvents Using Pulsed near-IR Radiation

The Interface and Fabrication Process of Diamond/Cu Composites with Nanocoated Diamond for Heat Sink Applications

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